Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Oh, Seung Jin | ko |
| dc.contributor.author | Lee, Sun-Woo | ko |
| dc.contributor.author | Ham, Yeong Seok | ko |
| dc.contributor.author | Kwon, Jeong Hyun | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.date.accessioned | 2024-01-05T03:00:19Z | - |
| dc.date.available | 2024-01-05T03:00:19Z | - |
| dc.date.created | 2024-01-02 | - |
| dc.date.issued | 2023-11-08 | - |
| dc.identifier.citation | The 14th International Symposium on NDT in Aerospace (AeroNDT2023) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/317428 | - |
| dc.language | English | - |
| dc.publisher | The Korean Society of Mechanical Engineers | - |
| dc.title | Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 14th International Symposium on NDT in Aerospace (AeroNDT2023) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | The Westin Chosun Busan | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | Ham, Yeong Seok | - |
| dc.contributor.nonIdAuthor | Kwon, Jeong Hyun | - |
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