DSpace at KOASAS
College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 86
  • Download : 0
Export
김준모 / 구창현 / 김택수researcher
Publisher
한국마이크로전자 및 패키징 학회
Issue Date
2020-11-12
Language
Korean
Citation

한국마이크로전자 및 패키징 학회 2020년도 추계 정기학술대회

URI
http://hdl.handle.net/10203/286706
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0