Browse "MS-Patent(특허)" by Issue Date 

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Showing results 1 to 20 of 1257

1
자기기록용금속자성분말을제조하는방법

이택동; 나종갑; 장평우, 1990-04-27

2
콘덴서용금속화플라스틱필름제조방법

이택동; 나종갑; 장평우; 조영래, 1990-07-02

3
Stainless maraging steel having high strength, high toughness and high corrosion resistance and it's manufacturing process

Kim, Young-Gil; Hong, Soon-Hyung; Seok, Jin I., 1992-05-26

4
FE-MN-AL계 극저온 구조용 합금

홍순형; 한영수, 1998-08-04

5
LE방법을 이용한 칩사이즈 패키지의 제조방법

백경욱; 장세영, 2000-01-21

6
N-형반도체다이아몬드의제조방법

유진; 이운선; 김정근, 2000-01-21

7
고부피분율 SiC분말함유 예비성형체의 제조장치 및 제조방법

홍순형, 2000-01-21

8
온도보상용유전체자기조성물

김호기; 박융; 캐빈 놀즈, 2000-07-12

9
Method for making n-type semiconductor diamond

Yu, Jin; Lee, Woong Sun; Kim, Jung Keun, 2000-08-01

10
SrTiO3-based grain boundary barrier layer capacitor

강석중, 2001-01-01

11
Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate

백경욱, 2001-05-01

12
Method of for Evaluating Photoinduced Domain Switching of Ferroelectric Ceramic using Acoustic Emission Tchnique

Choi, Si-Kyung; Choi, Dong Gu; Kim, Sung Ryul, 2001-05-08

13
실란커플링제 및 그의 제조방법

배병수, 2001-05-26

14
음향방출기법을이용한강유전체세라믹스의광여기분역반전평가방법

최시경; 최동구; 김성렬, 2001-07-02

15
Method for Making Barium Titanate Dielectrics

Kang, Suk-Joong L; Lee, Byung Ke; Lee, Ho Yong; Chung, Sung Yoon, 2001-09-20

16
비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법

백경욱, 2001-11-07

17
Inorganic-organic copolymer using polyvinylalcohol-silane coupling agent and preparation method thereof

배병수, 2002-01-08

18
BaTiO₃(Barium Titanate)계 유전체의제조방법

강석중, 2002-03-06

19
Method for making BaTiO3-based dielectric

강석중, 2002-03-19

20
Process for making oxide dispersion-strengthened tungsten heavy alloy by mechanical alloying

Hong, Soon-Hyung; Ryu, Ho Jin, 2002-04-09

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