Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Silicon
Showing results 1 to 19 of 19
| A 120-mW 0.16-ms-Latency Connectivity-Scalable Multiuser Detector for Interleave Division Multiple Access Kong, Byeong Yong; Park, In-Cheol, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.67, no.3, pp.470 - 474, 2020-03 |
| A Low-Jitter and Low-Fractional-Spur Ring-DCO-Based Fractional-N Digital PLL Using a DTC's Second-/Third-Order Nonlinearity Cancellation and a Probability-Density-Shaping Delta sigma M Hwang, Chanwoong; Park, Hangi; Lee, Yongsun; Seong, Taeho; Choi, Jaehyouk, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.57, no.9, pp.2841 - 2855, 2022-09 |
| (A) new uncooled IR detector using silicon diode : micromachined isolated silicon diode for IR detection(MISIR) = 단결정 실리콘 다이오드를 이용한 새로운 구조의 상온 적외선 검출 소자link Kim, Jae-Kwan; 김재관; et al, 한국과학기술원, 2001 |
| An Overturned Charge Injection Synaptic Transistor with a Floating-gate for Neuromorphic Hardware Computing Kim, Myung-Su; Kim, Jin-Ki; Yun, Gyeong-Jun; Yu, Ji-Man; Han, Joon-Kyu; Lee, Jung-Woo; Seo, Seokho; et al, IEEE ELECTRON DEVICE LETTERS, v.43, no.9, pp.1440 - 1443, 2022-09 |
| Application of Pulsed Green Laser Activation to Top-Tier MOSFET Fabrication for Monolithic 3-D Integration Park, Youngkeun; Jeong, Jaejoong; Noh, Semin; Kim, Heetae; Kim, Seongho; Kim, Kiryong; Kim, Dongbin; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.71, no.1, pp.890 - 895, 2024-01 |
| Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; Kim, Subin; Kang, Hyungmin; Sim, Boogyo; Kim, Seongguk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02 |
| Co-integrated Neuromorphic Devices for Bio-inspired Compliance Control Shin, Hery; Yu, Ji-Man; Han, Joon-Kyu; Choi, Yang-Kyu, IEEE TRANSACTIONS ON NANOTECHNOLOGY, v.22, pp.706 - 712, 2023-11 |
| Design methodology of high-density silicon interposer for integrated 3D IC GPU package = 집적화된 3차원IC GPU 패키지를 위한 고밀도 실리콘 인터포져 설계 방법론link Song, Tai-Gon; 송대건; et al, 한국과학기술원, 2009 |
| Design of grating based narrow band reflector on SOI waveguide Sharma, Tarun; Rana, Vaibhav; Wang, Jiaqi; Cheng, Zhenzhou; Chen, Yuzhi; Geng, Youfu; Hong, Xueming; et al, OPTIK, v.227, 2021-02 |
| Epitaxial Lift-Off Technology for Large Size III-V-on-Insulator Substrate Lee, Subin; Kim, Seongkwang; Han, Jae-Hoon; Song, Jin Dong; Jun, Dong-Hwan; Kim, Sang-Hyeon, IEEE ELECTRON DEVICE LETTERS, v.40, no.11, pp.1732 - 1735, 2019-11 |
Interfacial Dipole Modulation Device With SiOX Switching Species Kim, Giuk; Kim, Taeho; Jeon, Sanghun, IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, v.9, pp.57 - 60, 2021 |
| Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
| Performance Boost of Si TFETs by Insertion of III-V Dipole Formation Layer: A First Principle Study Lim, Yeongjun; Seo, Junbeom; Shin, Mincheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.6, pp.2956 - 2961, 2023-06 |
| Self-Heating Effects in 3-D Vertical-NAND (V-NAND) Flash Memory Yun, Gyeong-Jun; Yun, Dae-Hwan; Park, Jun-Young; Kim, Seong-Yoen; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.12, pp.5505 - 5510, 2020-12 |
| Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11 |
| Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09 |
| Thermoelectric characteristics of Pt-silicide/silicon multi-layer structured p-type silicon Choi, Won Chul; Jun, Dongseok; Kim, Soojung; Shin, Min-Cheol; Jang, Moongyu, ENERGY, v.82, pp.180 - 183, 2015-03 |
| Vertical InGaAs Biristor for Sub-1 V Operation Kim, Wu-Kang; Bidenko, Pavlo; Kim, Jongmin; Sim, Jaeho; Han, Joon-Kyu; Kim, Seongkwang; Geum, Dae-Myeong; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.5, pp.681 - 683, 2021-05 |
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