Browse "School of Electrical Engineering(전기및전자공학부)" by Subject TECHNOLOGY
Showing results 49 to 88 of 88
| H-Band Power Amplifiers in 65-nm CMOS by Adopting Output Power Maximized G(max)-Core and Transmission Line-Based Zero-Degree Power Networks Yun, Byeonghun; Park, Dae-Woong; Lee, Sang-Gug, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.58, no.11, pp.3089 - 3102, 2023-11 |
| HEAPO: Heap-Based Persistent Object Store Hwang, Taeho; Jung, Jaemin; Won, Youjip, ACM TRANSACTIONS ON STORAGE, v.11, no.1, 2015-02 |
| High-Performance Polycrystalline Silicon TFT on the Structure of a Dopant-Segregated Schottky-Barrier Source/Drain Choi, Sung-Jin; Han, Jin-Woo; Kim, Sung-Ho; Moon, Dong-Il; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.31, no.3, pp.228 - 230, 2010-03 |
| High-Q poly-to-poly capacitor for RF integrated circuits Lee, Sang-Gug; Lee, JT; Choi, JK, ELECTRONICS LETTERS, v.37, no.1, pp.25 - 26, 2001-01 |
| Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs Lee, JS; Choi, Yang-Kyu; Ha, DW; Balasubramanian, S; King, TJ; Bokor, J, IEEE ELECTRON DEVICE LETTERS, v.24, no.3, pp.186 - 188, 2003-03 |
| Low-power high-speed performance of current-mode logic D flip-flop topology using negative-differential-resistance devices Kim, T.; Jeong, Yong-Sik; Yang, Kyoung-Hoon, IET CIRCUITS DEVICES & SYSTEMS, v.2, no.2, pp.281 - 287, 2008-04 |
| Low-power PHEMT MMIC LNA for C-band applications Yuk, JS; Choi, YG; Lee, YS; Park, Chul Soon; Kang, S, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, pp.253 - 255, 2006-02 |
| LTCC stripline resonator using embedded air cavities for millimeter wave applications Lee, YC; Park, Chul Soon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.50, pp.658 - 661, 2008-03 |
| Matching Condition of Direct THz-Signal Detection from On-Chip Resonating Antennas with CMOS Transistors in Non-resonant Plasma Wave Mode Chai, Seung Wan; Lim, Sungmook; Kim, Choul-Young; Hong, Songcheol, JOURNAL OF INFRARED MILLIMETER AND TERAHERTZ WAVES, v.39, no.6, pp.521 - 534, 2018-06 |
| Measured results on symmetric dual-level spiral inductors for RF ICs Lee, Sang-Gug; Shin, SB; Ihm, GJ, IEICE TRANSACTIONS ON ELECTRONICS, v.E84C, no.6, pp.845 - 848, 2001-06 |
| Micromachined Fourier transform spectrometer on silicon optical bench platform Yu, Kyoungsik; Lee, D; Krishnamoorthy, U; Park, N; Solgaard, A, SENSORS AND ACTUATORS A-PHYSICAL, v.130, pp.523 - 530, 2006-08 |
| MN-MATE: Elastic Resource Management of Manycores and a Hybrid Memory Hierarchy for a Cloud Node Park, Kyu Ho; Hwang, Woomin; Seok, Hyunchul; Kim, Chulmin; Shin, Dong-Jae; Kim, Dong Jin; Maeng, Min Kyu; et al, ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, v.12, no.1, 2015-07 |
| Modeling Sub-Threshold Current-Voltage Characteristics in Thin Film Transistors Lee, Sungsik; Jeon, Sanghun; Nathan, Arokia, JOURNAL OF DISPLAY TECHNOLOGY, v.9, no.11, pp.883 - 889, 2013-11 |
| MOSFET Characteristics for Terahertz Detector Application From On-Wafer Measurement Kim, Suna; Park, Dae-Woong; Choi, Kyoung-Young; Lee, Sang-Gug, IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, v.5, no.6, pp.1068 - 1077, 2015-11 |
| Nonlinear Analysis of Nonresonant THz Response of MOSFET and Implementation of a High-Responsivity Cross-Coupled THz Detector Khan, Muhammad Ibrahim Wasiq; Kim, Suna; Park, Dae-Woong; Kim, Hyoung-Jun; Han, Seok-Kyun; Lee, Sang-Gug, IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, v.8, no.1, pp.108 - 120, 2018-01 |
| nvramdisk: A Transactional Block Device Driver for Non-Volatile RAM Jung, Jaemin; Won, Youjip, IEEE TRANSACTIONS ON COMPUTERS, v.65, no.2, pp.589 - 600, 2016-02 |
| Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMI Cho, In-Kui; Yun, Jae-Hoon; Jeong, Myung-Yung; Park, HyoHoon, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.722 - 728, 2010-08 |
| P-Channel Nonvolatile Flash Memory With a Dopant-Segregated Schottky-Barrier Source/Drain Choi, Sung-Jin; Han, Jin-Woo; Moon, Dong-Il; Kim, Sung-Ho; Jang, Moon-Gyu; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.57, no.8, pp.1737 - 1742, 2010-08 |
| Passively assembled optical inter-connection system based on an optical printed-circuit board Hwang, SH; Cho, MH; Kang, SK; Park, HyoHoon; Cho, HS; Kim, SH; Shin, KU; et al, IEEE PHOTONICS TECHNOLOGY LETTERS, v.18, no.5-8, pp.652 - 654, 2006-03 |
| PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models Pak, Jun-So; Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Ki-Yeong; Song, Tai-Gon; Ahn, Seung-Young; Lee, Jun-Ho; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.208 - 219, 2011-02 |
| Performance Comparison of 2×2 MIMO Antenna Arrays With Different Configurations and Polarizations in Reverberation Chamber at Millimeter-Waveband Park, Soon-Jin; Jeong, Myung-Hun; Bae, Kyung-Bin; Kim, Dong-Chan; Minz, Laxmikant; Park, Seong-Ook, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.65, no.12, pp.6669 - 6678, 2017-12 |
| Possibility and design of resonant terahertz emitters based on nanoscale strained silicon plasma wave transistors with enhanced mobility Park, Jong Yul; Kim, Sung-Ho; Choi, Yang-Kyu; Hong, Songcheol; Lee, Sang-Gug; Kim, Kyung Rok, JAPANESE JOURNAL OF APPLIED PHYSICS, v.53, no.6, 2014-06 |
| Power efficient Ka-band low phase noise VCO in 0.13 mu m CMOS Jung, D. Y.; Park, Chul Soon, ELECTRONICS LETTERS, v.44, no.10, pp.628 - 629, 2008-05 |
| Proposal of a ferroelectric multi-bit memory structure for reliable operation at sub-100 nm scale Kim, Woo-Young; Lee, Hee Chul, MICRO & NANO LETTERS, v.10, no.12, pp.700 - 702, 2015-12 |
| Silicon photonic wire filter using asymmetric sidewall long-period waveguide grating in a two-mode waveguide Cho, Young-Bo; Yang, Byung-Ki; Lee, Joo-Hyung; Yoon, Jun-Bo; Shin, Sang-Yung, IEEE PHOTONICS TECHNOLOGY LETTERS, v.20, no.5-8, pp.520 - 522, 2008-03 |
| Sloping profile and pattern transfer to silicon by shape-controllable 3-D lithography and ICP Jeon, JW; Yoon, Jun-Bo; Lim, Koeng Su, SENSORS AND ACTUATORS A-PHYSICAL, v.139, no.1-2, pp.281 - 286, 2007-09 |
| Small-area and high-inductance semi-stacked spiral inductor with high Q factor Ukaegbu, Ikechi Augustine; Choi, K. -S.; Hidayov, O.; Sangirov, Jamshid; Lee, T. -W.; Park, Hyo-Hoon, IET MICROWAVES ANTENNAS & PROPAGATION, v.6, no.8, pp.880 - 883, 2012-06 |
| Sub-1-V supply self-adaptive CMOS image sensor cell with 86-dB dynamic range Lee, S; Yang, Kyounghoon, IEEE ELECTRON DEVICE LETTERS, v.28, no.6, pp.492 - 494, 2007-06 |
| The Efficacy of Metal-Interfacial Layer-Semiconductor Source/Drain Structure on Sub-10-nm n-Type Ge FinFET Performances Kim, Jeong-Kyu; Kim, Gwang-Sik; Nam, Hyohyun; Shin, Changhwan; Park, Jin-Hong; Kim, Jong-Kook; Cho, Byung-Jin; et al, IEEE ELECTRON DEVICE LETTERS, v.35, no.12, pp.1185 - 1187, 2014-12 |
| The enhancement of Q factor in RPCVD SiGe varactors by the structural modification of the base-collector junction Mheen, B; Suh, D; Kim, SH; Shim, KH; Kang, JY; Hong, Songcheol, IEEE ELECTRON DEVICE LETTERS, v.24, no.4, pp.239 - 241, 2003-04 |
| The influence of interfacial defects on fast charge trapping in nanocrystalline oxide-semiconductor thin film transistors Kim, Taeho; Hur, Jihyun; Jeon, Sanghun, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.31, no.5, 2016-05 |
The Schottky barrier modulation at PtSi/Si interface by strain and structural deformation Srivastava, Pooja; Shin, Mincheol; Lee, Kwang-Ryeol; Mizuseki, Hiroshi; Kim, Seungchul, AIP ADVANCES, v.5, no.8, 2015-08 |
| Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
| Three-dimensional solar steam generation device with additional non-photothermal evaporation Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Tak; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Ultraviolet photon induced bulk, surface and interface modifications in n-Hg0.8Cd0.2Te in hydrogen environment Agnihotri, OP; Pal, R; Yang, KD; Bae, SH; Lee, SJ; Lee, MY; Choi, WS; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.7A, pp.4500 - 4502, 2002-07 |
| Use of a Columnar Metal Thin Film as a Nanosieve with Sub-10 nm Pores Choi, Dong-Hoon; Han, Yong Duk; Lee, Byung-Kee; Choi, Seon-Jin; Yoon, Hyun C.; Lee, Dae-Sik; Yoon, Jun-Bo, ADVANCED MATERIALS, v.24, no.32, pp.4408 - 4413, 2012-08 |
| Vertically Integrated Nanowire-Based Unified Memory Lee, Byung-Hyun; Ahn, Dae-Chul; Kang, Min-Ho; Jeon, Seung-Bae; Choi, Yang-Kyu, NANO LETTERS, v.16, no.9, pp.5909 - 5916, 2016-09 |
| Very Low-Work-Function ALD-Erbium Carbide (ErC2) Metal Electrode on High-K Dielectrics Ahn, Hyun Jun; Moon, Jungmin; Koh, Sungho; Seo, Yujin; Kim, Choong-Ki; Rho, Il Cheol; Kim, Choon Hwan; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.63, no.7, pp.2858 - 2863, 2016-07 |
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