Sloping profile and pattern transfer to silicon by shape-controllable 3-D lithography and ICP

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This paper describes a simple and effective method to fabricate various shapes and profiles of three-dimensional (3-D) silicon microstructures using a shape-controllable 3-D lithography along with dry plasma etching. The first step is to fabricate 3-D photoresist patterns with various slopes and round profiles on a silicon substrate by the shape-controllable 3-D lithography using polymer dispersed liquid crystal (PDLC) films, which is compatible to conventional lithography process. The second step is to transfer the sloping photoresist patterns into the silicon by etching 3-D photoresist molds and the silicon surface through inductively coupled plasma (ICP) process successively. The proposed microfabrication method for 3-D silicon microstructures can be widely applied for silicon lens arrays and silicon solar cells. (c) 2006 Elsevier B.V. All rights reserved.
Publisher
ELSEVIER SCIENCE SA
Issue Date
2007-09
Language
English
Article Type
Article; Proceedings Paper
Keywords

FABRICATION; TECHNOLOGY

Citation

SENSORS AND ACTUATORS A-PHYSICAL, v.139, no.1-2, pp.281 - 286

ISSN
0924-4247
URI
http://hdl.handle.net/10203/91745
Appears in Collection
EE-Journal Papers(저널논문)
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