Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 17521 to 17540 of 51041
| Extrinsic Calibration of 2-D Lidars Using Two Orthogonal Planes Choi, Dong-Geol; Bok, Yunsu; Kim, Jun-Sik; Kweon, In So, IEEE TRANSACTIONS ON ROBOTICS, v.32, no.1, pp.83 - 98, 2016-02 |
| Extrinsic Calibration of 2D Laser Sensors Kweon, In-So; Choi, Dong-Geol; Bok, Yunsu; Kim, Junsik, International Conference on Robotics & Automation (ICRA2014), IEEE Robotics and Automation Society, 2014-06-03 |
| Extrinsic calibration of a camera and a 2D laser without overlap Bok, Yunsu; Choi, Dong-Geol; Kweon, In-So, ROBOTICS AND AUTONOMOUS SYSTEMS, v.78, pp.17 - 28, 2016-04 |
| Extrinsic Calibration of LiDAR and Camera using Multiple Traffic Sings SONG, WONHO; Sung, Changki; Jung, Euigon; Oh, Minho; Myung, Hyun, 2021 World Congress on Advances in Nano, Bio, Robotics and Energy (ANBRE21), Techno-press, 2021-08-24 |
| Extrinsic Calibration of Non-overlapping Camera-Laser System using Structured Environment Bok, Yunsu; Kweon, In-So; Choi, Dong-Geol; Pascal Vasseur, IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS2014), IEEE Robotics and Automation Society (RAS), 2014-09-15 |
| Extrinsic information memory reduced architecture for non-binary turbo decoder implementation Park, S.M.; Kwak, J.; Lee, Kwyro, 2008 IEEE 67th Vehicular Technology Conference-Spring, VTC, pp.539 - 543, 2008-05-11 |
| EXTRINSIC VERSUS INTRINSIC MODELS FOR FETS YTTERDAL, T; FJELDLY, TA; Lee, Kwyro, PHYSICA SCRIPTA, v.54, pp.139 - 140, 1994 |
| Eye diagram estimation including crosstalk effect for high-speed channel on PCB, silicon and glass interposer = 인쇄 회로 기판, 실리콘과 유리 인터포저의 고속 채널을 위한 누화 효과 포함 아이 다이어그램 예측link Choi, Su-Min; 최수민; et al, 한국과학기술원, 2014 |
| Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket Park, Junyong; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Eye Diagram Estimation on Silicone Rubber Socket Park, Jun Yong; Kim, Hye Soo; Kim, Jong Hoon; Bae, Bum Hee; Ha, Dong Ho; Bae, Micahel; Kim, Joung Ho, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23 |
| Eye Fixation-Related Potentials during Visual Search on Acquaintance and Newly-Learned Faces Lee, Seungji; Lee, Doyoung; Gil, Hyunjae; Oakley, Ian; Cho, Yang Seok; Kim, Sung-Phil, BRAIN SCIENCES, v.11, no.2, 2021-02 |
| Eye Mouse System for the Disabled Chung, Myung Jin; Kim, J.H.; Lee, Y.J.; Chu, G.W.; Yoo, D.H.; Kim, D.H., 2000 Service Robot Workshop, pp.145 - 152, 2000-07 |
| Eye Mouse System using Eye-Gaze Direction Kim, Do Hyung; Kim, Jae Heon; Chung, Myung Jin, KIEE,IEEK,ICASE Joint Spring Conference on Control and Robotics, pp.13 - 16, 2000-03 |
| Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Eye-diagram estimation based on fourier-series signal decomposition technique in high-speed interconnects = 고속 신호선에서의 푸리에급수 신호 분해 기법 기반의 아이다이어그램 예측link Cho, Jeong-Hyeon; 조정현; et al, 한국과학기술원, 2011 |
| Eye-diagram estimation method for high-speed interconnect in through-silicon via (TSV) based three-dimensional IC (3-D IC) = 실리콘 관통 비아 기반 3차원 IC의 고속 채널을 위한 아이-다이어그램 예측 방법link Kim, Hee-Gon; 김희곤; et al, 한국과학기술원, 2011 |
| Eye-diagram estimation method for high-speed interconnect in through-silicon via (TSV) based three-dimensional IC (3-D IC) = 실리콘 관통 비아 기반 3차원 IC의 고속 채널을 위한 아이-다이어그램 예측 방법link Kim, Hee-Gon; 김희곤; et al, 한국과학기술원, 2011 |
| Eye-Diagram Estimation Methods for Voltage-and Probability-Dependent PAM4 Signal on Stacked Through-Silicon Vias (TSVs) Park, Junyong; Kim, Jonghoon J.; Choi, Sumin; Kim, Youngwoo; Kim, Joungho; Kim, Heegon, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1724 - 1731, Electronic Components and Technology Conference 2017, 2017-05-30 |
| Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Lee, Hyunsuk; et al, 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05-08 |
| Eye-diagram estimation with decision feedback equalizer for encoded and modulated data bit patterns = 부호화 및 변조된 데이터 비트 패턴에 대한 결정 재입력 등호기가 결합된 아이-다이어그램 예측 기법link Park, Junyong; 박준용; et al, 한국과학기술원, 2016 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,871 2020 - 2024
- 18,943 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989