| 1 | A Flexible and Robust Transparent Conducting Electrode Platform Using an Electroplated Silver Grid/Surface-Embedded Silver Nanowire Hybrid Structure Jang, Junho; Im, Hyeon-Gyun; Jin, Jungho; Lee, Jaemin; Lee, Jung-Yong; Bae, Byeong-Soo, ACS APPLIED MATERIALS & INTERFACES, v.8, no.40, pp.27035 - 27043, 2016-10 |
| 2 | A study on the conduction path in undoped polycrystalline diamond films Lee, BJ; Ahn, Byung Tae; Lee, JK; Baik, YJ, DIAMOND AND RELATED MATERIALS, v.10, no.12, pp.2174 - 2177, 2001-12 |
| 3 | (A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008 |
| 4 | Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating Jung, HR; Kim, HH; Lee, Won-Jong, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.5, pp.1067 - 1073, 2006-05 |
| 5 | CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03 |
| 6 | Effects of electrodeposited Co and Co-P catalysts on the hydrogen generation properties from hydrolysis of alkaline sodium borohydride solution Cho, Keun Woo; Kwon, Hyuk-Sang, CATALYSIS TODAY, v.120, pp.298 - 304, 2007-02 |
| 7 | Effects of plating parameters on alloy composition and microstructure of Sn-Bi electrodeposits from methane sulphonate bath Suh, MS; Park, CJ; Kwon, Hyuk-Sang, SURFACE & COATINGS TECHNOLOGY, v.200, pp.3527 - 3532, 2006-03 |
| 8 | Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating Park, JW; Rajendran, S; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.159, pp.1409 - 1415, 2006-09 |
| 9 | Electroplated metal grid/surface embedded silver nanowire hybrid structure for flexible transparent electrode = 투명전극용 전기 도금된 금속격자와 표면에 매립된 은 나노와이어 하이브리드 구조link Jang, Junho; 장준호; et al, 한국과학기술원, 2016 |
| 10 | Fabrication of three-dimensional (3D) hybrid nanostructures using material conversion methods and their applications = 소재 전환 기술을 이용한 3차원 하이브리드 나노 구조체의 제작과 응용에 관한 연구link Ahn, Changui; Jeon, Seok Woo; et al, 한국과학기술원, 2018 |
| 11 | Growth kinetics of Cu-Sn intermetallic compounds at interface of 80Sn-20Pb electrodeposits and Cu based leadframe alloy, and its influence on the fracture resistance to 90 degrees-bending Suh, MS; Kwon, Hyuk-Sang, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.39, no.10, pp.6067 - 6073, 2000-10 |
| 12 | Hydrogen generation from hydrolysis of NH3BH3 by an electroplated Co-P catalyst Eom, KwangSup; Cho, KeunWoo; Kwon, Hyuk-Sang, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.35, pp.181 - 186, 2010-01 |
| 13 | Improvement of Device Performance by Optimizing the Advanced DCV Process Condition in Dual-Damascene Cu Interconnects Lee, Min Hyung; Lee, Han Choon; Park, Chul Ho; Han, Jae-Won; Paik, Kyung-Wook, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.8, pp.644 - 647, 2009-06 |
| 14 | Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.1, pp.259 - 269, 2014-01 |
| 15 | Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| 16 | Residual stress effect on self-annealing of electroplated copper Lee, CH; Park, Chong-Ook, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.7, pp.4484 - 4488, 2003-07 |
| 17 | Sodium Borohydride의 수소 발생을 위한 다공성 Co-P 촉매 조근우; 권혁상; 엄광섭, 한국수소및신에너지학회논문집, v.17, no.4, pp.448 - 453, 2006-12 |
| 18 | The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12 |
| 19 | (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
| 20 | 나노템플릿을 이용한 금속 나노와이어 성장에 관한 연구 = A study on the growth of metal nanowires based on template methodlink 신호선; Shin, Ho-Sun; et al, 한국과학기술원, 2007 |
| 21 | 전해 및 무전해 도금법으로 제작된 ACF 접합용 Ni bump 특성에 관한 연구 = A comprarative study on the characterization of Ni bumps fabricated by electro and electroless plating for ACFlink 진경선; Jin, Kyoung-Sun; et al, 한국과학기술원, 2006 |
| 22 | 전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 = Fabrication of small eutectic Sn-Bi solder bumps by electroplatinglink 정회록; Jung, Hoe-Rok; et al, 한국과학기술원, 2003 |
