전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구Fabrication of small eutectic Sn-Bi solder bumps by electroplating
- Advisors
- 이원종researcher; Lee, Won-Jongresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2003
- Identifier
- 180275/325007 / 020003519
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ vii, 86 p. ]
- Keywords
플립칩; 전해도금; 틴 비스무쓰; 전자패키징; 범프; solder bump; electroplating; flip chip; eutectic; tin bismuth
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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