전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구Fabrication of small eutectic Sn-Bi solder bumps by electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이원종 | - |
| dc.contributor.advisor | Lee, Won-Jong | - |
| dc.contributor.author | 정회록 | - |
| dc.contributor.author | Jung, Hoe-Rok | - |
| dc.date.accessioned | 2011-12-15T01:35:09Z | - |
| dc.date.available | 2011-12-15T01:35:09Z | - |
| dc.date.issued | 2003 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=180275&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/50911 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ vii, 86 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 플립칩 | - |
| dc.subject | 전해도금 | - |
| dc.subject | 틴 비스무쓰 | - |
| dc.subject | 전자패키징 | - |
| dc.subject | 범프 | - |
| dc.subject | solder bump | - |
| dc.subject | electroplating | - |
| dc.subject | flip chip | - |
| dc.subject | eutectic | - |
| dc.subject | tin bismuth | - |
| dc.title | 전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 | - |
| dc.title.alternative | Fabrication of small eutectic Sn-Bi solder bumps by electroplating | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 180275/325007 | - |
| dc.description.department | 한국과학기술원 : 재료공학과, | - |
| dc.identifier.uid | 020003519 | - |
| dc.contributor.localauthor | 이원종 | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
- Appears in Collection
- MS-Theses_Master(석사논문)
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