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Showing results 1 to 10 of 10

1
A new method for mapping the three-dimensional atomic distribution within nanoparticles by atom probe tomography (APT)

Kim, Se-Ho; Kang, Phil Woong; Park, O Ok; Seol, Jae-Bok; Ahn, Jae-Pyoung; Lee, Ji Yeong; Choi, Pyuck-Pa, ULTRAMICROSCOPY, v.190, pp.30 - 38, 2018-07

2
Charge discharge characteristics of a layered-structure electroplated Cu/Sn anode for Li-ion batteries

Park, JungWon; Eom, JiYong; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.55, no.5, pp.1825 - 1828, 2010-02

3
Effects of electroplating parameters on the defects of copper via for 3D SiP

Cho, Byeong-Hoon; Lee, Won-Jong; Lee, Jae-Ho, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 1, pp.49 - 52, 2007-06

4
Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints

Yu, Jin; Kim, J. Y., ACTA MATERIALIA, v.56, no.19, pp.5514 - 5523, 2008-11

5
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints

Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10

6
Studies on the electroplated flip chip solder bumping processes and Solder/UBM (Under Bump Metallization) interfacial reactions = 전해도금 플립칩 솔더 범프 형성 공정 및 솔더/UBM (under bump metallization) 간의 계면반응에 관한 연구link

Jang, Se-Young; 장세영; et al, 한국과학기술원, 2002

7
무연솔더와 도금된 구리배선에서 전류의 영향에 의한 계면반응의 변화에 관한 연구 = Effect of electromigration on interfacial reaction between electroplated Cu Pad with SPS and Pb-free solder jointlink

강현우; Kang, Hyun-woo; et al, 한국과학기술원, 2009

8
반도체 배선용 구리 전기도금막의 Self-annealing 기구분석 = Analysis of self-annealing mechanism in electroplated Cu thin film for the interconnect of semiconductor deviceslink

이창희; Lee, Chang-Hee; et al, 한국과학기술원, 2003

9
전해도금법을 이용한 공정 납-주석 플립칩 솔더범프와 UBM(Under Bump Metallurgy)계면에 관한 연구 = Interfacial studies on the electroplated eutectic Pb/Sn flip-chip solder bump and UBM(Under Bump Metallurgy)link

장세영; Jang, Se-Young; et al, 한국과학기술원, 1998

10
전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법 = Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplatinglink

김종연; Kim, Jong-Yeon; et al, 한국과학기술원, 2003

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