전해도금을 이용한 Ni계 UBM 및 Sn-Ag 솔더 범프 형성 방법Fabrication method of Ni based under bump metallurgy and sn-ag solder bump by electroplating
- Advisors
- 유진researcher; Yu, Jinresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2003
- Identifier
- 180299/325007 / 020013135
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 2003.2, [ iv, 78 p. ]
- Keywords
UBM; 솔더범프; 전해도금; 금속간화합물; Intermetallic compound; UBM; solder bump; Electroplating
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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