전해도금법을 이용한 공정 납-주석 플립칩 솔더범프와 UBM(Under Bump Metallurgy)계면에 관한 연구Interfacial studies on the electroplated eutectic Pb/Sn flip-chip solder bump and UBM(Under Bump Metallurgy)

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Advisors
백경욱researcherPaik, Kyung-Wookresearcher
Description
한국과학기술원 : 재료공학과,
Publisher
한국과학기술원
Issue Date
1998
Identifier
133557/325007 / 000963532
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 재료공학과, 1998.2, [ iv, 83 p. ]

Keywords

공정 납/주석; 금속간 화합물; 전해도금; 플립칩; 솔더범프; Eutectic Pb/Sn; IMC(Intermetallic Compound); Electroplating; UBM(Under Bump Metallurgy); Flip chip

URI
http://hdl.handle.net/10203/50686
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133557&flag=dissertation
Appears in Collection
MS-Theses_Master(석사논문)
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