Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title 

Showing results 16101 to 16120 of 19473

16101
Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15

16102
Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link

Kim, Il; 김일; et al, 한국과학기술원, 2008

16103
Wafer to wafer bonding using electroplated Co-Sn solder layer

Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22

16104
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

16105
Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07

16106
Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05

16107
Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection

Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11

16108
Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks

Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01

16109
Wafer-Scale Synthesis of Highly Oriented 2D Topological Semimetal PtTe2 via Tellurization

Choi, Minhyuk; Oh, Saeyoung; Hahn, Sungsoo; Ji, Yubin; Jo, Min-kyung; Kim, Jeongtae; Ju, Tae-Seong; et al, ACS NANO, v.18, no.23, pp.15154 - 15166, 2024-05

16110
Wafer-scale synthesis of monolayer two-dimensional porphyrin polymers for hybrid superlattices

Zhong, Yu; Cheng, Baorui; Park, Chibeom; Ray, Ariana; Brown, Sarah; Mujid, Fauzia; Lee, Jae-Ung; et al, SCIENCE, v.366, no.6471, pp.1379 - 1384, 2019-12

16111
Wafer-Scale Unidirectional Alignment of Supramolecular Columns on Faceted Surfaces

Jin, Hyeong Min; Park, Kangho; Kwon, Kiok; Yang, Geon Gug; Han, Young-Soo; Kim, Hwa Soo; Kim, Sang Ouk; et al, ACS NANO, v.15, no.7, pp.11762 - 11769, 2021-07

16112
Warm white LEDs에 적용을 위한 3색 발광 $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ 형광체의 합성 및 발광 특성 연구 = Synthesis of tunable full color emitting $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ phosphor for the application to warm white LEDs and its characterizationlink

원유호; Won, Yu-Ho; et al, 한국과학기술원, 2006

16113
Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition

Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

16114
Water absorption characteristics of fluorinated silicon oxide films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition using SiH4, SiF4 and O-2

Byun, KM; Lee, Won-Jong, THIN SOLID FILMS, v.376, no.1-2, pp.26 - 31, 2000-11

16115
Water as a hole-predatory instrument to create metal nanoparticles on triple-conducting oxides

Kim, Jun Hyuk; Hong, Jaewoon; Lim, Dae-Kwang; Ahn, Sejong; Kim, Jinwook; Kim, Jun Kyu; Oh, DongHwan; et al, ENERGY & ENVIRONMENTAL SCIENCE, v.15, no.3, 2022-03

16116
Water Oxidation Mechanism for Co-containing Polyoxometalate

권순호; 신기현; 류명신; 이혁모, 2014년 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2014-04-25

16117
Water oxidation-coupled, photoelectrochemical redox biocatalysis toward mimicking natural photosynthesis

Nam, Dong-Heon; Ryu, Gyeong Min; Kuk, Su Keun; Choi, Da Som; Son, Eun Jin; Park, Chan Beum, APPLIED CATALYSIS B-ENVIRONMENTAL, v.198, pp.311 - 317, 2016-12

16118
Water removal characteristics of proton exchange membrane fuel cells using a dry gas purging method

Lee, Sang-Yeop; Kim, Sang-Uk; Kim, Hyoung-Juhn; Jang, Jong Hyun; Oh, In-Hwan; Cho, Eun Ae; Hong, Seong-Ahn; et al, JOURNAL OF POWER SOURCES, v.180, no.2, pp.784 - 790, 2008-06

16119
Water-induced degradation of chromium fluoride films

Kim, EN; Hong, Daniel Seungbum; Gorman, JD; Lim, SC; Moon, SY; Kim, DW; No, Kwangsoo, THIN SOLID FILMS, v.324, no.1-2, pp.292 - 299, 1998-07

16120
Water-related abnormal instability of transparent oxide/organic hybrid thin film transistors

Yang, Shinhyuk; Hwang, Chi-Sun; Lee, Jeong-Ik; Yoon, Sung-Min; Ryu, Min-Ki; Cho, Kyoung-Ik; Park, Sang-Hee Ko; et al, APPLIED PHYSICS LETTERS, v.98, no.10, 2011-03

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