Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 16041 to 16060 of 19424
| W-Ni-Fe 중합금에서 기지상 조성과 열처리에 따른 미세조직 변화와 기계적 성질 = Effect of matrix composition and heat-treatment on the microstructural development and mechanical properties of W-Ni-Fe heavy alloylink 노준웅; Noh, Joon-Woong; et al, 한국과학기술원, 1993 |
| W-Ni-Fe 중합금에서 불순물의 영향과 기계적 성질의 향상에 관한 연구 = Effect of impurities and improvement of mechanical properties in W-Ni-Fe heavy alloylink 홍성현; Hong, Seong-Hyun; et al, 한국과학기술원, 1990 |
| W-Ni-Fe 중합금에서 진공처리와 소결분위기가 기계적 성질에 미치는 영향 = The effects of vacuum treatment and sintering atmosphere on mechanical properties of W-Ni-Fe heavy alloylink 이상훈; Lee, Sang-Hoon; et al, 한국과학기술원, 1981 |
| W-Ni-Fe 중합금의 액상소결중 소결분위기의 변화가 기공소멸에 미치는 영향 = Effect of atmosphere change on the liquid-filling of pores during liquid phase sintering of W-Ni-Felink 홍병선; Hong, Byung-Sun; 윤덕용; 강석중; et al, 한국과학기술원, 1985 |
| W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거 홍성현; 강석중; 윤덕용, 대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01 |
| W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계 백승헌; 조순하; 조영훈; 박병국, 2015 동계학술대회, 한국 자기학회, 2015-11-27 |
| Wafer exfoliation 기술을 이용한 플렉서블 이차전지 제작 및 방법 이건재; 박귀일; 황건태; 정창규, 2014-06-30 |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 |
| Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link Kim, Il; 김일; et al, 한국과학기술원, 2008 |
| Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steve; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum Philip, ACS NANO, v.6, no.1, pp.451 - 458, 2012-01 |
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