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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

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Lee, Soon-Bokresearcher / Paik, Kyung-Wookresearcher / Kwom, WS / Yang, SY
Issue Date
2002
Language
ENG
Citation

5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209

URI
http://hdl.handle.net/10203/136167
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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