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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPaik, Kyung-Wook-
dc.contributor.authorKwom, WS-
dc.contributor.authorYang, SY-
dc.date.accessioned2013-03-16T21:39:39Z-
dc.date.available2013-03-16T21:39:39Z-
dc.date.created2012-02-06-
dc.date.issued2002-
dc.identifier.citation5th International Symposium on Electronic Materials and Packagings 2003, v., no., pp.204 - 209-
dc.identifier.urihttp://hdl.handle.net/10203/136167-
dc.languageENG-
dc.titleAnalytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage204-
dc.citation.endingpage209-
dc.citation.publicationname5th International Symposium on Electronic Materials and Packagings 2003-
dc.identifier.conferencecountryTaiwan, Province of China-
dc.identifier.conferencecountryTaiwan, Province of China-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKwom, WS-
dc.contributor.nonIdAuthorYang, SY-
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ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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