Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Article
Showing results 9121 to 9180 of 12271
| Thermal Properties and Phonon Spectral Characterization of Synthetic Boron Phosphide for High Thermal Conductivity Applications Kang, Joon Sang; Wu, Huan; Hu, Yongjie, NANO LETTERS, v.17, no.12, pp.7507 - 7514, 2017-12 |
| Thermal radiation at the nanoscale and applications Chapuis, Pierre-Olivier; Lee, Bong Jae; Rodriguez, Alejandro, APPLIED PHYSICS LETTERS, v.123, no.22, 2023-11 |
| Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry Pan, Heng; Ko, Seung Hwan; Grigoropoulos, Costas P., APPLIED PHYSICS LETTERS, v.93, no.23, 2008-12 |
| Thermal snapping and vibration characteristics of cylindrical composite panels using layerwise theory Oh, Il-Kwon; Lee, In, COMPOSITE STRUCTURES, v.51, no.1, pp.49 - 61, 2001-01 |
| Thermal softening behavior up to fracture initiation during high-rate deformation Lee, Chang Soo; Yoon, Jeong Whan; Woo, Sang Hyun; Park, Lee Ju, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.251, 2023-08 |
| Thermal stability characteristics of high-power, large-capacity, reserve thermal batteries with pure Li and Li(Si) anodes Cho, Jang-Hyeon; Im, Chae Nam; Choi, Chi Hun; Ha, Sang-hyeon; Yoon, Hyun-Ki; Choi, Yusong; Bae, Joongmyeon, ELECTROCHIMICA ACTA, v.353, 2020-09 |
| Thermal stabilization for accurate dimensional measurement using gallium Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06 |
| Thermal stress analysis in structural elements of HRSG casing Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012 |
| Thermal stress and fatigue analysis of exhaust manifold Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004 |
Thermal transport in layer-by-layer assembled polycrystalline graphene films Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03 |
| THERMAL-ANALYSIS OF SOLIDIFICATION BY THE TEMPERATURE RECOVERY METHOD TSZENG, TC; Im, Yong-Taek; KOBAYASHI, S, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.29, no.1, pp.107 - 120, 1989-01 |
| Thermal-Conductivity Enhancement by Surface Electromagnetic Waves Propagating along Multilayered Structures with Asymmetric Surrounding Media Lim, Mikyung; Ordonez-Miranda, Jose; Lee, Seung-Seob; Lee, Bong Jae; Volz, Sebastian, PHYSICAL REVIEW APPLIED, v.12, no.3, 2019-09 |
| Thermally Controlled Localized Porous Graphene for Integrated Graphene-Paper Electronics Tham, Nicholas Cheng Yang; Sahoo, Pankaj Kumar; Kim, Yeongae; Hegde, Chidanand; Lee, Seok Woo; Kim, Young-Jin; Murukeshan, Vadakke Matham, ADVANCED MATERIALS TECHNOLOGIES, v.6, no.5, 2021-05 |
| Thermally enhanced osmotic power generation from salinity difference Han, Jeonghoon; Ko, Young-Su; Nam, Youngsuk; Lee, Choongyeop, JOURNAL OF MEMBRANE SCIENCE, v.672, 2023-04 |
| THERMALLY INDUCED FLOW OSCILLATION IN VERTICAL 2-PHASE NATURAL CIRCULATION LOOP Lee, Sang Yong; ISHII, M, NUCLEAR ENGINEERING AND DESIGN, v.122, no.1-3, pp.119 - 132, 1990-09 |
| Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 |
| Thermally-forced stratification build-up in an initially isothermal, contained fluid Hyun, Jae Min, JOURNAL OF THE PHYSICAL SOCIETY OF JAPAN, v.54, no.3, pp.942 - 949, 1985-03 |
| Thermally/mechanically robust anodic aluminum oxide (AAO) microheater platform for low power chemoresistive gas sensor Lee, Byeongju; Cho, Incheol; Kang, Mingu; Yang, Daejong; Park, Inkyu, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.33, no.8, 2023-08 |
| Thermo-compressive transfer printing for facile alignment and robust device integration of nanowires Lee, Won Seok; Won, Sejeong; Park, Jeunghee; Lee, Jihye; Park, Inkyu, NANOSCALE, v.4, no.11, pp.3444 - 3449, 2012-03 |
| Thermo-elasto-plastic finite element analysis of quenching process of carbon steel Kang, SH; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.192-193, no.SI, pp.381 - 390, 2007-08 |
| Thermo-elastohydrodynamic analysis of connecting rod bearing in internal combustion engine Kim B.-J.; Kim, Kyung-Woong, JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, v.123, no.3, pp.444 - 454, 2001-07 |
| Thermo-hydraulic analysis of the KSTAR central solenoid model coil Chung, WH; Park, S; Wang, QL; Jeong, Sangkwon; Yoon, CS; Oh, YK; Kim, K; et al, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.15, no.2, pp.1411 - 1414, 2005-06 |
| Thermo-mechanical response of single-phase face-centered-cubic AlxCoCrFeNi high-entropy alloy microcrystals Jiao, Quan; Sim, Gi-Dong; Komarasamy, Mageshwari; Mishra, Rajiv S.; Liaw, Peter K.; El-Awady, Jaafar A., MATERIALS RESEARCH LETTERS, v.6, no.5, pp.300 - 306, 2018-03 |
| Thermodynamic and kinetic hydrate inhibition performance of aqueous ethylene glycol solutions for natural gas Cha, Min-Jun; Shin, Kyu-Chul; Kim, June-Young; Chang, Daejun; Seo, Yu-Taek; Lee, Huen; Kang, Seong-Pil, CHEMICAL ENGINEERING SCIENCE, v.99, pp.184 - 190, 2013-08 |
| Thermodynamic inhibition of 4-methylmorpholine while forming sH hydrate with methane Park, Seongmin; Kang, Hyery; Lim, Dongwook; Lee, Jong-Won; Seo, Yutaek; Lee, Huen, CHEMICAL ENGINEERING SCIENCE, v.138, pp.347 - 352, 2015-12 |
| Thermodynamic performance comparison of a two-stage cryocooler and cascade cryocoolers with thermal anchoring for precooling purpose Jeong, Sangkwon; Jin, Lingxue, CRYOGENICS, v.99, pp.32 - 38, 2019-04 |
| Thermoelastic analysis of circular arc-shaped cracks Chung, HD; Beom, HG; Choi, SY; Earmme, Youn-Young, JOURNAL OF THERMAL STRESSES, v.21, no.2, pp.129 - 140, 1998-03 |
| Thermoelastic interaction between a crack and a circular inhomogeneity Chung, DY; Huh, MS; Earmme, Youn Young, INTERNATIONAL JOURNAL OF FRACTURE, v.111, no.1, pp.L9 - L14, 2001-09 |
| Thermoelectric Sensor with CuI Supported on Rough Glass Panama, Gustavo; Lee, Seung-Seob, NANOMATERIALS, v.14, no.1, 2024-01 |
| Thermomechanical analyses of laser precision joining for optoelectronic components Chang, WS; Na, Suck-Joo, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.2, pp.349 - 358, 2003-06 |
| Thermomechanical Behavior of Poly(3-hexylthiophene) Thin Films on the Water Surface Ma, Boo Soo; Lee, Jin-Woo; Park, Hyeonjung; Kim, Bumjoon J.; Kim, Taek-Soo, ACS OMEGA, v.7, no.23, pp.19706 - 19713, 2022-06 |
| Thermomechanical fatigue behavior of the ferritic stainless steel Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005 |
| Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
| Thermophoresis in the cryogenic temperature range Lee, BU; Kim, Sang Soo, JOURNAL OF AEROSOL SCIENCE, v.32, no.1, pp.107 - 119, 2001-01 |
| THERMOPHORESIS OF HIGHLY ABSORBING, EMITTING PARTICLES IN LAMINAR TUBE FLOW YOA, SJ; Kim, Sang Soo; LEE, JS, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.11, no.2, pp.98 - 104, 1990-06 |
| THERMOPHORETIC DEPOSITION OF ABSORBING, EMITTING AND ISOTROPICALLY SCATTERING PARTICLES IN LAMINAR TUBE FLOW WITH HIGH PARTICLE MASS LOADING PARK, SUNG HO; Kim, Sang Soo, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.36, no.14, pp.3477 - 3485, 1993-09 |
| Thermophoretic transport and deposition of particles in vertical tube flow with variable wall temperature and thermal radiation Park, SH; Kim, WJ; Kim, Sang Soo, KSME INTERNATIONAL JOURNAL, v.13, no.3, pp.253 - 263, 1999-03 |
| Thermophotonic cells in self-sustaining parallel circuits Yang, Zhimin; Song, Jaeman; Lee, Bong Jae, JOURNAL OF QUANTITATIVE SPECTROSCOPY & RADIATIVE TRANSFER, v.312, 2024-01 |
| Thermophotovoltaic Energy Conversion in Far-to-Near-Field Transition Regime Song, Jaeman; Jang, Junho; Lim, Mikyung; Choi, Minwoo; Lee, Jungchul; Lee, Bong Jae, ACS PHOTONICS, v.9, no.5, pp.1748 - 1756, 2022-05 |
| Thermopiezoelastic nonlinear dynamics of active piezolaminated plates Oh, Il-Kwon, SMART MATERIALS & STRUCTURES, v.14, no.4, pp.823 - 834, 2005-08 |
| Thermopiezoelastic snapping of piezolaminated plates using layerwise nonlinear finite elements Oh, Il-Kwon; Han, Jae-Hung; Lee, In, AIAA JOURNAL, v.39, no.6, pp.1188 - 1197, 2001-06 |
| Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
| Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01 |
| Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
| THERMOVISCOPLASTIC ANALYSIS OF HYPERSONIC STRUCTURES SUBJECTED TO SEVERE AERODYNAMIC HEATING Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, JOURNAL OF AIRCRAFT, v.27, no.9, pp.826 - 835, 1990-09 |
| Thickness minimized magnetic circuit for rotary-type voice coil motor Jeong, JH; Lee, JH; Yoon, HK; Gweon, Dae-Gab, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.44, no.3, pp.1262 - 1263, 2005-03 |
| Thickness-profile measurement of transparent thin-film layers by white-light scanning interferometry Kim, Seung-Woo; Kim, GH, APPLIED OPTICS, v.38, no.28, pp.5968 - 5973, 1999-10 |
| Thin film display based on polymer waveguides Park, Suntak; Park, Bong Je; Yun, Sungryul; Nam, Saekwang; Park, Seung Koo; Kyung, Ki-Uk, OPTICS EXPRESS, v.22, no.19, pp.23433 - 23438, 2014-09 |
| Thin-film thickness profile and its refractive index measurements by dispersive white-light interferometry Ghim, Young-Sik; Kim, Seung-Woo, OPTICS EXPRESS, v.14, no.24, pp.11885 - 11891, 2006-11 |
| Three Degrees of Freedom Active Control of Pneumatic Vibration Isolation Table by Pneumatic and Time Delay Control Technique Shin, YH; Kim, Kwang-joon; Chang, PH; Han, DK, JOURNAL OF VIBRATION AND ACOUSTICS-TRANSACTIONS OF THE ASME, v.132, no.5, 2010-10 |
| Three dimensional analysis of high frequency induction welding of steel pipes with impeder Kim, HJ; Youn, Sung-Kie, JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, v.130, no.3, 2008-06 |
| Three dimensional elements with Lagrange multipliers for the modified couple stress theory Kwon, Young Rok; Lee, Byung-Chai, COMPUTATIONAL MECHANICS, v.62, no.1, pp.97 - 110, 2018-07 |
| Three dimensional multi-step inverse analysis for the optimum blank design in sheet metal forming processes Lee, CH; Huh, Hoon, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.80-1, pp.76 - 82, 1998 |
| Three Dimensional Upper Limb Joint Kinetics of a Golf Swing with Measured Internal Grip Force Choi, Hyeob; Park, Sukyung, SENSORS, v.20, no.13, 2020-07 |
| Three Way Relationship of Human-Robot Interaction Hwang, Jung-Hoon; Lee, KangWoo; Kwon, Dong-Soo, LECTURE NOTES IN COMPUTER SCIENCE, v.4552, pp.321 - 330, 2007-07 |
| Three-axis lever actuator with flexure hinges for an optical disk system Han, CS; Kim, Soohyun, REVIEW OF SCIENTIFIC INSTRUMENTS, v.73, no.10, pp.3678 - 3686, 2002-10 |
| Three-Degrees-of-Freedom Passive Gravity Compensation Mechanism Applicable to Robotic Arm With Remote Center of Motion for Minimally Invasive Surgery Kim, Chang-Kyun; Chung, Deok Gyoon; Hwang, Minho; Cheon, Byungsik; Kim, Hansoul; Kim, Joonhwan; Kwon, Dong-Soo, IEEE Robotics and Automation Letters, v.4, no.4, pp.3473 - 3480, 2019-10 |
| Three-Dimensional Analysis of Molten Pool in GMA-Laser Hybrid Welding Cho, JH; Na, Suck-Joo, WELDING JOURNAL, v.88, no.2, pp.35S - 43S, 2009-02 |
| Three-dimensional bulk metal forming simulations under a PC cluster environment Cheon, JS; Kim, SY; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.140Special, no.SI, pp.36 - 42, 2003-09 |
| Three-dimensional coherent structure in a separated and reattaching flow over a backward-facing step Lee, I; Ahn, SK; Sung, Hyung Jin, EXPERIMENTS IN FLUIDS, v.36, pp.373 - 383, 2004-03 |
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