Browse "Dept. of Mechanical Engineering(기계공학과)" by Type Article

Showing results 8381 to 8400 of 12338

8381
Soft, skin-interfaced microfluidic systems with integrated immunoassays, fluorometric sensors, and impedance measurement capabilities

Kim, Sungbong; Lee, Boram; Reeder, Jonathan; Seo, Seon Hee; Lee, Sung-Uk; Hourlier-Fargette, Aurelie; Shin, Joonchul; et al, PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, v.117, no.45, pp.27906 - 27915, 2020-10

8382
SoftGait: compliant walking assistance via pneumatically actuated robot legs

Koo, Donghan; Kim, Byungjin; Kim, Kyung-Soo; Kim, Soohyun, ELECTRONICS LETTERS, v.49, no.19, pp.1208 - 1209, 2013-09

8383
SOG를 이용한 실리콘과 유리의 저온 접합 공정

유중돈; 이재학, 대한용접접합학회지, v.23, no.6, pp.0 - 0, 2005-12

8384
Solar array deployment analysis considering path-dependent behavior of a tape spring hinge

Kim, Kyung Won; Park, Young-Jin, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.29, no.5, pp.1921 - 1929, 2015-05

8385
Solar thermophotovoltaic energy conversion systems with two-dimensional tantalum photonic crystal absorbers and emitters

Nam, Youngsuk; Yeng, Yi Xiang; Lenert, Andrej; Bermel, Peter; Celanovic, Ivan; Soljacic, Marin; Wang, Evelyn N., SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.122, pp.287 - 296, 2014-03

8386
Solder Joints Inspection Using a Neural Network and Fuzzy Rule-Based Classification Method

Ko, Kuk Won; Cho, Hyung Suck, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.23, no.2, pp.93 - 103, 2000-04

8387
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

8388
Soldering method using longitudinal ultrasonic

Kim, Jung Ho; Lee, J; Yoo, Choong-Don, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, no.3, pp.493 - 498, 2005-09

8389
Solid-state lasers for frequency metrology

Kärtner, F.X; Mücke, O.D; Wagenblast, P; Ell, R; Winter, A; Kim, Jungwon; Siddiqui, A; et al, LEOS SUMMER TOPICAL MEETING, v.2005, no.0, pp.85 - 86, 2005

8390
Solid-State Nanopore for Molecular Detection

Haq, Muhammad Refatul; Lee, Bong Jae; Lee, Jungchul, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.22, no.12, pp.2001 - 2026, 2021-12

8391
Solutal Marangoni flows of miscible liquids drive transport without surface contamination

Kim, Hyoungsoo; Muller, Koen; Shardt, Orest; Afkhami, Shahriar; Stone, Howard A., NATURE PHYSICS, v.13, no.11, pp.1105 - 1110, 2017-11

8392
Solution for spin-up from rest of liquid with a free surface

Kim, KY; Hyun, Jae Min, AIAA JOURNAL, v.34, no.7, pp.1441 - 1446, 1996-07

8393
Solution of coupled acoustic problems: A partially opened cavity coupled with a membrane and a semi-infinite exterior field

Kim, Yang-Hann; Kim, SM, JOURNAL OF SOUND AND VIBRATION, v.254, no.2, pp.231 - 244, 2002-07

8394
Solution Processed Aluminum Paper for Flexible Electronics

Lee, Hye-Moon; Lee, Ha-Beom; Jung, Dae-Soo; Yun, Jung-Yeul; Ko, Seung-Hwan; Park, Seung-Bin, LANGMUIR, v.28, no.36, pp.13127 - 13135, 2012-09

8395
Solution processed polymer light-emitting diodes utilizing a ZnO/organic ionic interlayer with Al cathode

Youn, Hong-Seok; Yang, Min-Yang, APPLIED PHYSICS LETTERS, v.97, no.24, 2010-12

8396
Solution-Assembled Blends of Regioregularity-Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance

Kim, Hyeong Jun; Lee, Moo Yeol; Kim, Jin-Seong; Kim, Jae Han; Yu, Hojeong; Yun, Hong-Seok; Liao, Kin; et al, ACS APPLIED MATERIALS & INTERFACES, v.9, no.16, pp.14120 - 14128, 2017-04

8397
Solution-based adaptive parallel patterning by laser-induced local plasmonic surface defunctionalization

Kang, Bong-Chul; Kim, Jong-Su; Yang, Min-Yang, OPTICS EXPRESS, v.20, no.27, pp.29111 - 29120, 2012-12

8398
Solution-Processable Ag-Mediated ZnO Nanowires for Scalable Low-Temperature Fabrication of Flexible Devices

Choi, Hyunsik; Kim, Kwangjun; Kim, Minwook; Kim, Jeong Dae; Cho, Incheol; Kim, Inhwan; Chae, Hyoungseok; et al, ACS APPLIED ELECTRONIC MATERIALS, v.4, no.3, pp.910 - 916, 2022-03

8399
Solving the Controversy on the Wetting Transparency of Graphene

Kim, Donggyu; Pugno, Nicola M.; Buehler, Markus J.; Ryu, Seunghwa, SCIENTIFIC REPORTS, v.5, 2015-10

8400
Solving the Shallow Water equations using 2D SPH particles for interactive applications

Lee, Hyokwang; Han, Soonhung, VISUAL COMPUTER, v.26, no.6-8, pp.865 - 872, 2010-06

rss_1.0 rss_2.0 atom_1.0