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| Wafer exfoliation 기술을 이용한 플렉서블 이차전지 제작 및 방법 이건재; 박귀일; 황건태; 정창규, 2014-06-30 |
| Wafer fabrication scheduling subject to resource constraints = 자원제약을 고려한 웨이퍼 제조 스케쥴링link Joo, Byung-Jun; 주병준; et al, 한국과학기술원, 2007 |
| Wafer flow time control of track systems for semiconductor manufacturinglink Lee, Minho; Lee, Tae-Eog; et al, 2021 |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer Level Fabrication of Plasmonic Nanopores using Solid-state Diffusion Hwang, Charles Soon Hong; Lee, Young Seop; Jeong, Ki Hun, 한국광학회 2016년도 하계학술대회, (사)한국광학회, 2016-07-11 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 |
| Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link Kim, Il; 김일; et al, 한국과학기술원, 2008 |
| Wafer polishing performance of silica slurries with silica particles grown by sol-gel method Bae, SH; So, JH; Yang, Seung-Man; Kim, DH, Material Research Society 2000 Spring Meeting, 2000 |
| Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정 배귀남; 박승오; 이춘식; 명현국; 신흥태, 설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05 |
| Wafer temperature simulation and control algorithm in RTA system 조병진; Kim, KT; Kim, CK, Conf. on CAD, Semiconductor Material and Components, pp.0 - 0, 1987-05-12 |
| Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 |
| Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
| Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs) Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wook; Jung, GJ; Lee, JK, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 |
| Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
| Wafer-level packaging for MEMS devices with nanoporous materials = 나노 크기의 기공을 갖는 물질을 이용한 MEMS 소자의 웨이퍼 레벨 패키징에 관한 연구link Lee, Byung-Kee; 이병기; et al, 한국과학기술원, 2010 |
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