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| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Reliability evaluation for flip-chip electronic packages using optical measurement techniques = 광 측정 기법을 이용한 플립 칩 전자패키지의 신뢰성 평가link Yang, Se-Young; 양세영; et al, 한국과학기술원, 2005 |
| Reliability Evaluation Methodologies of Fault Tolerant Techniques of Digital I&C Systems in Nuclear Power Plants KIM, Bo Gyung; KANG, Hyun Gook; LEE, Seung Jun; Seong, Poong-Hyun, ICI 2011 (ISOFIC + CSEPC +ISSNP), 2011-08-23 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, J.-W.; Suk, K.-L.; Paik, K.-W.; Lee, Soon-Bok, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, v.7522, no.0, pp.0 - 0, 2010 |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 |
| Reliability graph with general gates (RGGG): A novel method for reliability analysis Seong, Poong-Hyun; SHIN, Seung-Ki, INTERNATIONAL ELECTRONIC JOURNAL OF NUCLEAR SAFETY AND SIMULATION, v.1, no.3, pp.180 - 197, 2010-10 |
| Reliability Graph with General Gates: An Intuitive and Practical Method for General System Reliability Analysis Kim, Man Cheol; Seong, Poong-Hyun, The Conference of CUP's Nuclear I&C Subtask, 2002-07 |
| Reliability graph with general gates: an intuitive and practical method for system reliability analysis Kim, MC; Seong, Poong-Hyun, RELIABILITY ENGINEERING SYSTEM SAFETY, v.78, no.3, pp.239 - 246, 2002-12 |
| Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29 |
| Reliability improvement of a flexible FD-SOI MOSFET via heat management Bong, Jae Hoon; Kim, Seung-Yoon; Jeong, Chan Bae; Chang, Ki Soo; Hwang, Wan Sik; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.110, no.25, 2017-06 |
| Reliability Improvement of Charge Trap Flash Memory Cell with Sealing Oxide in Fluorine Incorporation 이승환; 이태윤; 안현준; 이태인; 신의중; 신성원; 조병진, 제26회 한국반도체학술대회, DB하이텍, 한국반도체산업협회, 한국반도체연구조합, 2019-02-14 |
| Reliability improvement of embedded real-time systems using time redundancy = 시간 여유를 이용한 내장형 실시간 시스템의 신뢰도 향상에 관한 연구link Ryu, Sang-Moon; 유상문; et al, 한국과학기술원, 2006 |
| Reliability Improvement of Experimental Setup with Transparent Windows Visualizing the Two-phase Flow in PEMFC Lee Dongryul; Bae Joongmyeon, FUCE 2010 (Fuel Cells Science and Technology 2010), Elsevier, 2010-10-06 |
| Reliability Improvement of Gate-All-Around Junctionless SONOS Memory by Joule Heat From Inherent Nanowire Current Lee, Jung-Woo; Han, Joon-Kyu; Kim, Myung-Su; Yu, Ji-Man; Jung, Jin-Woo; Yun, Seong-Yun; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.69, no.11, pp.6133 - 6138, 2022-11 |
| Reliability Improvement of Gate-All-Around SONOS Memory by Joule Heat From Gate-Induced Drain Leakage Current Lee, Jung-Woo; Han, Joon-Kyu; Yu, Ji-Man; Lee, Geon-Beom; Tcho, Il-Woong; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.69, no.1, pp.115 - 119, 2022-01 |
| Reliability improvement of microprocessor systemlink Hong, Sun-Gi; 홍선기; et al, 한국과학기술원, 1977 |
| Reliability improvement of nonlinear ultrasonic modulation based fatigue crack detection using feature-level data fusion Lim, Hyung Jin; Kim, Yongtak; Sohn, Hoon; Jeon, Ikgeun; Liu, Peipei, SMART STRUCTURES AND SYSTEMS, v.20, no.6, pp.683 - 696, 2017-12 |
| Reliability improvement of satellite-based quantum key distribution systems using retransmission scheme Nguyen, Nam D.; Phan, Hang T. T.; Pham, Hien T. T.; Mai, Vuong V.; Dang, Ngoc T., PHOTONIC NETWORK COMMUNICATIONS, v.42, no.1, pp.27 - 39, 2021-08 |
| Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
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