Reliability evaluation for flip-chip electronic packages using optical measurement techniques광 측정 기법을 이용한 플립 칩 전자패키지의 신뢰성 평가
- Advisors
- Lee, Soon-Bokresearcher; 이순복researcher
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2005
- Identifier
- 244784/325007 / 020005180
- Language
- eng
- Description
학위논문(박사) - 한국과학기술원 : 기계공학전공, 2005.2, [ xiv, 186 p. ]
- Keywords
Flip-Chip; Reliability; Optical Measurement Technique; 광 측정 기법; 플립 칩; 신뢰성
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.