Browse "College of Engineering(공과대학)" by Author Kwon, YM
Showing results 1 to 19 of 19
| A mechanistic critical heat flux model for wide range of subcooled and low quality flow boiling Kwon, YM; Chang, Soon-Heung, NUCLEAR ENGINEERING AND DESIGN, v.188, no.1, pp.27 - 47, 1999-04 |
| A procedure to predict subcooled-water-flow-boiling CHF in uniformly heated tubes for high-heat-flux applications Kwon, YM; Chang, Soon-Heung, NUCLEAR TECHNOLOGY, v.130, no.3, pp.310 - 328, 2000-06 |
| A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs Lee, Soon-Bok; Paik, KW; Jeon, YD; Yang, SY; Kwon, YM, Pan Pacific Microelectronics symposium, 2005 |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 |
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 |
| Bumpless ball grid array (BBGA) package using a solder resist cavity Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26 |
| Development of a Water Resistant Biopolymer Compound for Soil Strengthening 임주영; Kwon, YM; Lee, JH; Chang, IH; Cho, Gye Chun, the 28th KKHTCNN symposium on Civil Engineering, KKHTCNN, 2015-11-16 |
| Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints Kwon, YM; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 |
| Effect of Pd addition on ultra-fine pitch Au wire/Al pad interface Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 60th Electronic Components and Technology Conference, ECTC 2010, pp.329 - 335, ECTC, 2010-06-01 |
| Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish Park, YS; Kwon, YM; Son, HY; Moon, JT; Jeong, BW; Kang, KI; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0, 123, 2007-11-19 |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1436 - 1441, ECTC, 2010-06-01 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 |
| Investigation of Biopolymer Treatment Feasibility to Mitigate Surface Erosion Using a Hydraulic Flume Apparatus Lee, Sojeong; Kwon, YM; Cho, Gye-Chun; Chang, Ilhan, Geo-Congress 2020: Biogeotechnics, pp.46 - 52, American Society of Civil Engineers (ASCE), 2020-02 |
| Prediction of Critical Heat Flux in Highly Subcooled Covective Boiling Kwon, YM; Chang, Soon-Heung, The 9th International Topical Meeting on Nuclear Reactor Thermal Hydaulics, 1999 |
| Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die Yu, SY; Kwon, YM; Kim, J; Jeong, T; Choi, S; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.460 - 466, ECTC, 2011-05-31 |
| Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 |
| Two-Phase Flow Modeling of Critical Heat Flux for Subcooled and Low-Quality Flow Boiling Kwon, YM; Suk, SD; Chang, Soon-Heung, The 1st Korea-Japan Symposium on Nuclear Thermal Hydaulics and Safety, 1998 |
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- 24,279 2020 - 2024
- 75,432 2010 - 2019
- 57,255 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989