Browse "College of Engineering(공과대학)" by Author Fan, Jun
Showing results 1 to 13 of 13
| Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08 |
Analysis and Introduction of Effective Permeability with Additional Air-Gaps on Wireless Power Transfer Coils for Electric Vehicle Based on SAE J2954 Recommended Practice Kim, Dongwook; Kim, Hongseok; Huang, Anfeng; He, Qiusen; Zhang, Hanyu; Ahn, Seungyoung; Zhu, Yuyu; et al, ENERGIES, v.12, no.24, 2019-12 |
| Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System Kim, Hongseok; Fan, Jun; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.648 - 653, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
| Closed-Form Expressions for the Noise Voltage Caused by a Burst Train of IC Switching Currents on a Power Distribution Network Kim, Jingook; Lee, Jongjoo; Ahn, Seung-Young; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.56, no.6, pp.1585 - 1597, 2014-12 |
| Design of On-Chip Linear Voltage Regulator ModuleAnd Measurement of Power Distribution NetworkNoise Fluctuation at High-Speed Output Buffer Lee, Man Ho; Kim, Hee Gon; Kim, Suk Jin; Kim, Joung Ho; Cho, Jong Hyun; Yoon, Chang Wook; Achkir, Brice; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25 |
| Detection of open and short faults in 3D-ICs based on through silicon via (TSV) Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Joungho; Fan, Jun, IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.405 - 410, Institute of Electrical and Electronics Engineers Inc., 2017-08 |
| Electric Parameter Tuning of Wireless Power Transfer Coil for Charging Interoperability of Electric Vehicles Kim, Dongwook; Ahn, Seungyoung; He, Qiusen; Huang, Anfeng; Fan, Jun; Kim, Hongseok, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.619 - 622, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
| Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02 |
| Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12 |
| Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling Piersanti, S; Pellegrino, E; De Paulis, F; Orlandi, A; Kim, Joungho; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.406 - 411, Institute of Electrical and Electronics Engineers Inc., 2016-07 |
| Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics Fan, Jun; Carvalho, Nuno Borges; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12 |
| Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08 |
| Modeling and Analysis of High Speed Switching Buck Converter IC for Conducted Emission Estimation Park, Jaehyoung; Song, Chiuk; Park, Jonghyun; Kweon, Hycksu; Ahn, Seungyoung; Fan, Jun; Kim, Hongseok, 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, EMC EUROPE 2020, Institute of Electrical and Electronics Engineers Inc., 2020-09 |
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