Browse "College of Engineering(공과대학)" by Type Conference
Showing results 73641 to 73660 of 90923
| W2F2Q : 무선 패킷 네트워크에서 공평 큐잉 이융; 석용호; 최양희; 한동원, 한국통신학회 하계학술대회, 2000 |
| W2F2Q: Packet Fair Queuing inWireless Packet Networks Yi, Yung; Seok, Yongho; Kwon, Taekyoung; Choi, Yanghee; Park, Junseok, The 3rd ACM International Workshop on Wireless Mobile Multimedia, WoWMoM 2000, pp.2 - 10, ACM, 2000-08-11 |
| WADN: Web Application Delivery Network Kim, Jungsook; Jo, SungJae; Song, Junehwa; Lim, Minyeol; Park, Hyungwoo, International Conference on Ubiquitous Computing(ICUC), pp.0 - 0, ICUC, 2003-10-01 |
| Wafer admission control for clustered photolithography tools Park, Kyung Soo; Morrison J.R., 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010, pp.220 - 225, 2010-07-11 |
| Wafer admission control for clustered photolithography tools Park, Kyungsu; Morrison, James R, Advanced Semiconductor Manufacturing Conference , pp.220 - 225, ASMC, 2010-07 |
| Wafer Coating Process of Cu-based Methanol Steam Reforming Catalysts for Wafer Based MEMS Catalytic Reactor Kim, Taegyu; Lee, Dae Hoon; Yoon, Chun Ho; Kwon, Sejin, The 6th International Symposium on Nanocomposites & Nanoporous Materials, 2005-02 |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer Level Fabrication of Plasmonic Nanopores using Solid-state Diffusion Hwang, Charles Soon Hong; Lee, Young Seop; Jeong, Ki Hun, 한국광학회 2016년도 하계학술대회, (사)한국광학회, 2016-07-11 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 |
| Wafer polishing performance of silica slurries with silica particles grown by sol-gel method Bae, SH; So, JH; Yang, Seung-Man; Kim, DH, Material Research Society 2000 Spring Meeting, 2000 |
| Wafer temperature simulation and control algorithm in RTA system 조병진; Kim, KT; Kim, CK, Conf. on CAD, Semiconductor Material and Components, pp.0 - 0, 1987-05-12 |
| Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 |
| Wafer-scale Fabrication of 3D Asymmetric Hierarchical Photonic Structures in Nature Yang, Sung Pyo; Jeong, Ki Hun, ISNIT 2016, ISNIT, 2016-01-13 |
| Wafer-scale fabrication of biodegradable silk-fibroin-based memristors Kook, Geon; Jeong, Sohyeon; Kim, Mikyung; Lee, Sungwoo; Kim, Hyojung; Choi, Nakwon; Lee, Hyunjoo Jenny, 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018, pp.86 - 89, Institute of Electrical and Electronics Engineers Inc., 2018-01-22 |
| Wafer-scale growth of amorphous boron nitride thin film Kim, Hyeongjoon; Kim, Kiryong; Lee, Sun-Woo; Lee, Min Yung; Lee, Gyusoup; Park, YoungKeun; Kim, Heetae; et al, Boron Nitride Workshop 2023, Montpellier University, 2023-05-29 |
| Wake Analysis and Visualization for Offshore Floating Wind Turbine Kim, Hyuncheol; Han, Soonhung, International Symposium on Computational Design and Engineering 2017, Society for Computational Design and Engineering, 2017-12-14 |
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