Browse "College of Engineering(공과대학)" by Type Conference
Showing results 59241 to 59260 of 90968
| Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) Lee, Soon-Bok, Tokyo Tech-KAIST joint workshop, pp.3 - 4, 2005 |
| Reliability assessment of advanced materials and structures Lee, Soon-Bok, APCMM09, 2009-11 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
| Reliability Assessment of Electronic Packaging and Thin Film Lee Soon-Bok, ICMR2011(International Conference on Materials Reliability 2011), KSME, 2011-11 |
| Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics Lee, Soon-Bok; Kim, Ilho, APCOM'07 in conjunction with EPMESC XI, 2011-08-12 |
| Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics Lee, Soon-Bok, 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), 2014-07-22 |
| Reliability Assessment of Electronics Packaging with Fringe Pattern Analysis Lee, Soon-Bok; Ham, Suk-Jin, ICEM05, pp.17 -, 2005 |
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
| Reliability assessment of translated VMF/link-16 messages Kim, Jingyu; Kang, Sungwon; Lee, Nohbok, 19th International Symposium on Software Reliability Engineering, ISSRE 2008, pp.283 - 284, 2008-11-10 |
| Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods Lee, Soon-Bok; Ham, SJ, Workshop on Flip Chip Packaging, 1999 |
| Reliability Assessments of Lead-contained and Lead-free BGA Solder Joints under Cyclic Bending Loads Kim, IH; Lee, Soon-Bok, 대한기계학회 신뢰성부문 및 한국신뢰성학회 공동학술대회, pp.64 - 71, 2006 |
| Reliability based design optimization for crashworthiness of a spot welded hat type member Kim, Yu Jong; Huh, Hoon, 8th World Congress on Structural and Multidisciplinary Optimization, WCSMO8, 2009-06-01 |
| Reliability based design optimization of a flexible wing Kwon, Jang-Hyuk, The Asian CFD Society, pp.0 - 0, The Asian CFD Society, 2005-10 |
| Reliability based design optimization using the response surface augmented moment method Kwak, Byung Man, World Congress on Structural and Multidisciplinary Optimization, pp.102 -, 2005 |
| Reliability based multi-disciplinary design optimization Kwon, Jang-Hyuk, KSEA-KOFST-KUSCO, pp.0 - 0, 2005-08 |
| Reliability Based Optimal Design Using POD Technique KWAK BYUNG MAN, pp.66 - 79, 1987-05-01 |
| Reliability based real-time slope stability assessment 이승래; 최정찬, KGS fall national conference 2008, 2008 |
| Reliability based robust design of a vibratory micro gyroscope Kwak, Byung Man, pp.162 - 163, 2001-06-01 |
| Reliability based slope monitoring system considering shallow slope failure induced by rainfall infiltration Lee, Seung Rae; Choi, J.C., ANCRiSST 2008, 2008 |
| Reliability Based Structural Optimal Design Considering Non-normal Distributions of Fatigue Strength KWAK BYUNG MAN, pp.0 - 0, 1992-05-01 |
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