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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability assessment of BGA solder joints under cyclic bending loads

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Kim, Ilho / Lee, Soon-Bokresearcher
Issue Date
2005-12-11
Language
ENG
Citation

EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32

URI
http://hdl.handle.net/10203/144178
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ME-Conference Papers(학술회의논문)
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