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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics

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Lee, Soon-Bokresearcher / Kim, Ilho
Issue Date
2011-08-12
Language
ENG
Citation

APCOM'07 in conjunction with EPMESC XI

URI
http://hdl.handle.net/10203/24886
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ME-Conference Papers(학술회의논문)
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