Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Kim, Ilho | - |
| dc.date.accessioned | 2011-08-12T07:17:49Z | - |
| dc.date.available | 2011-08-12T07:17:49Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-08-12 | - |
| dc.identifier.citation | APCOM'07 in conjunction with EPMESC XI, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/24886 | - |
| dc.description.sponsorship | This work was supported by Ministry of Science and Technology in Korea through “Development of Reliability Design Technique and Life Prediction Model for Electronic Components”. | en |
| dc.language | ENG | - |
| dc.language.iso | en_US | en |
| dc.title | Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | APCOM'07 in conjunction with EPMESC XI | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Kim, Ilho | - |
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