Browse "College of Engineering(공과대학)" by Type Conference
Showing results 65401 to 65420 of 90973
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies on Preparation of Monodispersed Silica Particles using Sol-Gel Method and Rheological Behaviors of Silica Dispersion 양승만, 한국화학공학회 춘계학술발표회, pp.905 - 908, 한국화학공학회, 1996-04-01 |
| Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003 |
| Studies on the application of supercritical carbon dioxide cycle to a small modular reactor Yoon,HJ; Ahn,Y; Lee,JH; Lee, JeongIk, International Congress on Advances in Nuclear Power Plants 2011 (ICAPP 2011), French Nuclear Energy Society, 2011-05 |
| Studies on the Biodegradation of Polyurethanes under Compositing Conditions. Kim, Sung Chul, Pacific Polymer Conference, 1997 |
| Studies on the dimensional and piezoelectric characteristics of 3D printed piezoelectric structures KIM, InSup; Yoon, Yong Jin, International Symposium on Precision Engineering and Sustainable Manufacturing, PRESM 2021, 한국정밀공학회, 2021-07-21 |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
| Studies on the Interfacial Tensions of Liquid Metal-Fluid Systems 류가빈; 김형수, 재 12회 한국유체공학학술대회, 한국전산유체공학회, 2022-06-23 |
| Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers Sang-Won Kang, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991 |
| Studies on the modification of Epoxy resin with polydimethylsiloxane Kim, Sung Chul, 36th IUPAC international symposium on macromolecules, 1996 |
| Studies on the Surface Morphology of BCB films by Plasma Ions Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01 |
| Studies on the synthesis of mesoporous molecular sieves, MCM-41 and its potential applicability to hydrotreating catalyst system 김충현; 홍석봉; 우성일, 한국화학공학회 춘계학술발표회, pp.963 -, 한국화학공학회, 1995-04 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
| Studies on thin film integral passive components for mixed mode multichip module (MCM) applications Paik, Kyung-Wook, Proceedings of the 1995 IEEE/CPMT 18th International Electronic Manufacturing Technology, pp.365 - 368, 1995-12-04 |
| Studies on various 2-metal chip-on-flex (COF) packaging methods Suk, KL; Kim, JS; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1125 - 1131, ECTC, 2010-06-01 |
| STUDIES RELEVANT TO IN-VESSEL STEAM EXPLOSIONS Yang, Ji-Won, 4TH INT. TOPICAL MTGON NUCLEAR REACTOR THERMAL-HYDRAULICS, pp.10 - 13, 1989-10-01 |
| (studio-projects) Mirror Mirror: An On-Body Clothing Design System Saakes, Daniel Pieter; Hui-Shyong Yeo; Seung-Tak Noh; Han Gyeol; Woo, Woon-Tack, The 42nd International Conference and Exhibition on Computer Graphics and Interactive Techniques, ACM Special Interest Group on Computer Graphics and Interactive Techniques (SIGGRAPH), 2015-08-13 |
| (studio-talks) Mirror Mirror: An On-body Clothing Design System Saakes, Daniel Pieter; Yeo, Hui Shyong; Noh, Seun Tak; Han, Gyeol; Woo, Woon-Tack, The 42nd International Conference and Exhibition on Computer Graphics and Interactive Techniques, ACM Special Interest Group on Computer Graphics and Interactive Techniques (SIGGRAPH), 2015-08-12 |
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