Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages
- Publisher
- IEEE
- Issue Date
- 2003-05-27
- Language
- English
- Citation
53rd Electronic Components and Technology Conference 2003, pp.1589 - 1593
- ISSN
- 0569-5503
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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