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Kim, Joungho (김정호)
교수, (전기및전자공학부)

https://tera.kaist.ac.kr/

Research Area
EMI/EMC, A, A
Co-researchers
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    Controller Area Network With Flexible Data Rate (CAN FD) Eye Diagram Prediction

    Park, Junyong; Lee, Manho; Park, Shinyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.66, no.3, pp.949 - 959, 2024-06

    2
    Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment Optimization of Microbumps Considering Signal and Power Integrity

    Park, Joonsang; Choi, Seonguk; Son, Keeyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.14, no.4, pp.681 - 692, 2024-04

    3
    Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity

    Kim, Keunwoo; Park, Hyunwook; Kim, SeongGuk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.66, no.1, pp.256 - 269, 2024-02

    4
    Bayesian Exploration Imitation Learning-Based Contextual via Design Optimization Method of PAM-4-Based High-Speed Serial Link

    Kim, Jihun; Kim, Minsu; Kim, Haeyeon; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.65, no.6, pp.1751 - 1762, 2023-12

    5
    Fast and Accurate Computation of Wireless Power Transfer System Optimal Design Using Particle Swarm Optimization Method

    Sim, Boogyo; Shin, Taein; Park, Hyunwook; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.65, no.6, pp.1674 - 1683, 2023-12

    6
    Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module

    Choi, Seonguk; Son, Keeyoung; Park, Hyunwook; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.11, pp.1804 - 1816, 2023-11

    7
    Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)

    Park, Hyunwook; Kim, Minsu; Kim, Seongguk; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.11, pp.4772 - 4786, 2022-11

    8
    Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module

    Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09

    9
    지능형 전장인식을 위한 엣지 컴퓨팅 기반 인공지능 가속기 성능 분석

    손기영; 김성국; 윤지원; et al, 전자공학회논문지, v.59, no.7, pp.41 - 49, 2022-07

    10
    A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection

    Zhang, Shuye; Park, Junyong; Park, Gapyeol; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

    11
    Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer

    Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02

    12
    Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure

    Son, Kyungjune; Kim, Minsu; Park, Hyunwook; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01

    13
    Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

    Kim, Seongguk; Kim, Subin; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11

    14
    Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

    Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10

    15
    Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

    Shin, Taein; Park, Shinyoung; Kim, Seongguk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07

    16
    A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

    Sim, Boogyo; Jeong, Seungtaek; Kim, Youngwoo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.935 - 946, 2021-06

    17
    Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

    Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04

    18
    Generator Polynomial Model-Based Eye Diagram Estimation Method for Bose-Chaudhuri-Hocquenghem (BCH) Code and Reed-Solomon (RS) Code

    Park, Junyong; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.62, no.1, pp.240 - 248, 2020-02

    19
    A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application

    Hong, Seokwoo; Kim, Youngwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.2031 - 2039, 2019-12

    20
    Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics

    Fan, Jun; Carvalho, Nuno Borges; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12
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