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Kim, Joungho (김정호)
교수, School of Electrical Engineering(전기및전자공학부)

http://tera.ac.kr

Research Area
EMI/EMC
Co-researchers
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection

    Zhang, Shuye; Park, Junyong; Park, Gapyeol; et al, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

    2
    Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer

    Lho, Daehwan; Park, Hyunwook; Park, Shinyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.64, no.1, pp.196 - 208, 2022-02

    3
    Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure

    Son, Kyungjune; Kim, Minsu; Park, Hyunwook; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01

    4
    Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

    Kim, Seongguk; Kim, Subin; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11

    5
    Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer

    Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10

    6
    Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

    Shin, Taein; Park, Shinyoung; Kim, Seongguk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07

    7
    A Near Field Analytical Model for EMI Reduction and Efficiency Enhancement Using an nth Harmonic Frequency Shielding Coil in a Loosely Coupled Automotive WPT System

    Sim, Boogyo; Jeong, Seungtaek; Kim, Youngwoo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.3, pp.935 - 946, 2021-06

    8
    Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

    Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04

    9
    Generator Polynomial Model-Based Eye Diagram Estimation Method for Bose-Chaudhuri-Hocquenghem (BCH) Code and Reed-Solomon (RS) Code

    Park, Junyong; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.62, no.1, pp.240 - 248, 2020-02

    10
    Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling

    Park, Junyong; Park, Shinyoung; Kim, Youngwoo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1867 - 1875, 2019-12

    11
    Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics

    Fan, Jun; Carvalho, Nuno Borges; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12

    12
    A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application

    Hong, Seokwoo; Kim, Youngwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.2031 - 2039, 2019-12

    13
    Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

    Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09

    14
    A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias

    Park, Junyong; Jung, Daniel H.; Kim, Byunggon; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.4, pp.1198 - 1206, 2019-08

    15
    Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System

    Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06

    16
    Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material

    Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.5, pp.4054 - 5064, 2019-05

    17
    Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

    Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.317 - 328, 2019-02

    18
    Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

    Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01

    19
    High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

    Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12

    20
    Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

    Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12
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