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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

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dc.contributor.authorLee, J.ko
dc.contributor.authorSeng, Y.M.ko
dc.contributor.authorRotaru, M.D.ko
dc.contributor.authorIyer, M.K.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2007-06-26T06:45:41Z-
dc.date.available2007-06-26T06:45:41Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2003-05-27-
dc.identifier.citation53rd Electronic Components and Technology Conference 2003, pp.1589 - 1593-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/667-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCharacterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages-
dc.typeConference-
dc.identifier.wosid000183448100262-
dc.identifier.scopusid2-s2.0-0038688708-
dc.type.rimsCONF-
dc.citation.beginningpage1589-
dc.citation.endingpage1593-
dc.citation.publicationname53rd Electronic Components and Technology Conference 2003-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationNew Orleans LA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorSeng, Y.M.-
dc.contributor.nonIdAuthorRotaru, M.D.-
dc.contributor.nonIdAuthorIyer, M.K.-
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EE-Conference Papers(학술회의논문)
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