Search
Results 1-6 of 6 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| The effect of the multi-pass non-circular drawing sequence on mechanical properties and microstructure evolution of low-carbon steel Lee, Jung Wan; Baek, Hyun Moo; Hwang, Sun Kwang; Son, Il-Heon; Bae, Chul Min; Im, Yong-Taek, MATERIALS & DESIGN, v.55, pp.898 - 904, 2014-03 | |
| Specimen and Grain Size Effects of Al1100 on Strain and Strain Rate Hardening at Various Strain Rates for Al1100 Kwon, Junbeom; Huh, Hoon; Kim, J. S., EXPERIMENTAL MECHANICS, v.54, no.6, pp.987 - 998, 2014-07 | |
| Role of Graphene in Reducing Fatigue Damage in Cu/Gr Nanolayered Composite Hwang, Byungil; Kim, Wonsik; Kim, Jaemin; Lee, Subin; Lim, Seoyoen; Kim, Sangmin; Oh, Sang Ho; Ryu, Seunghwa; Han, Seung Min, NANO LETTERS, v.17, no.8, pp.4740 - 4745, 2017-08 | |
| Highly Enhanced Electromechanical Stability of Large-Area Graphene with Increased Interfacial Adhesion Energy by Electrothermal-Direct Transfer for Transparent Electrodes Kim, Jangheon; Kim, Gi Gyu; Kim, Soohyun; Jung, Wonsuk, ACS APPLIED MATERIALS & INTERFACES, v.8, no.35, pp.23396 - 23403, 2016-09 | |
| Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 | |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |