Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

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An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu6Sn5 grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface. (C) 2017 Elsevier B.V. All rights reserved.
Publisher
ELSEVIER SCIENCE SA
Issue Date
2017-04
Language
English
Article Type
Article
Keywords

MOLTEN SNAGCU SOLDER; SN-AG; JOINTS; COPPER; LAYER; STRENGTH; BEHAVIOR; CU3SN

Citation

JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541

ISSN
0925-8388
DOI
10.1016/j.jallcom.2017.01.109
URI
http://hdl.handle.net/10203/223018
Appears in Collection
ME-Journal Papers(저널논문)
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