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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Inertia-driven flow symmetry breaking by oscillating plates Lim, Daegyu; Lahooti, Mohsen; Kim, Daegyoum, AIP ADVANCES, v.9, no.10, 2019-10 | |
| Microstructure arrays of DNA using topographic control Cha, Yun Jeong; Park, Soon Mo; You, Ra; Kim, Hyoungsoo; Yoon, Dong Ki, NATURE COMMUNICATIONS, v.10, 2019-06 | |
| Design of Shape Memory Alloy-Based Soft Wearable Robot for Assisting Wrist Motion Jeong, Jaeyeon; Bin Yasir, Ibrahim; Han, Jungwoo; Park, Cheol Hoon; Bok, Soo-Kyung; Kyung, Ki-Uk, APPLIED SCIENCES-BASEL, v.9, no.19, 2019-09 | |
| Explaining Evaporation-Triggered Wetting Transition Using Local Force Balance Model and Contact Line-Fraction Annavarapu, Rama Kishore; Kim, Sanha; Wang, Minghui; Hart, A. John; Sojoudi, Hossein, SCIENTIFIC REPORTS, v.9, no.1, 2019-01 | |
| Microstructured Ceramic-Coated Carbon Nanotube Surfaces for High Heat Flux Pool Boiling Zhao, Hangbo; Dash, Susmita; Dhillon, Navdeep Singh; Kim, Sanha; Lettiere, Bethany; Varanasi, Kripa K.; Hart, A. John, ACS APPLIED NANO MATERIALS, v.2, no.9, pp.5538 - 5545, 2019-09 | |
| Coherent power amplification of third-order harmonic femtosecond pulses at thin-film up-conversion nanoparticles Gao, Yi; Lee, Hyub; Xu, Wen; Jiao, Jiannan; Chen, Peng; Kim, Dong-Hwan; KIM, Young-Jin, SCIENTIFIC REPORTS, v.9, no.5094, 2019-03 | |
| Synthetic Butterfly Scale Surfaces with Compliance‐Tailored Anisotropic Drop Adhesion Zhao, Hangbo; Park, Sei Jin; Solomon, Brian R.; Kim, Sanha; Soto, Dan; Paxson, Adam T.; Varanasi, Kripa K.; Hart, A. John, ADVANCED MATERIALS, v.31, no.14, pp.1807686, 2019-04 | |
| Ultrafast volume holography for stretchable photonic structures Tham, Nicholas Cheng Yang; Sahoo, Pankaj K.; KIM, Young-Jin; Murukeshan, Vadakke Matham, OPTICS EXPRESS, v.27, no.9, pp.12196 - 12212, 2019-04 | |
| Effects of walking speed and slope on pedobarographic findings in young healthy adults Koo, Seungbum; Park, Moon Seok; Chung, Chin Youb; Yoon, Ji Soo; Park, Chulhee; Lee, Kyoung Min, PLOS ONE, v.14, no.7, pp.e0220073, 2019-07 | |
| 휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정 김형준; 안광호; 오승진; 김도한; 김재성; 김은숙; 김택수, 마이크로전자 및 패키징학회지, v.26, no.4, pp.101 - 105, 2019-12 |
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