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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Superstrong encapsulated monolayer graphene by the modified anodic bonding Jung, Won Suk; Yoon, Taeshik; Choi, Jongho; Kim, Soohyun; Kim, Yong Hyup; Kim, Taek-Soo; Han, Chang-Soo, NANOSCALE, v.6, no.1, pp.547 - 554, 2014-01 | |
| Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process Hwang, Jaewon; Yoon, Taeshik; Jin, Sung Hwan; Lee, Jinsup; Kim, Taek-Soo; Hong, Soon-Hyung; Jeon, Seokwoo, ADVANCED MATERIALS, v.25, no.46, pp.6724 - 6729, 2013-12 | |
| Penetration and lateral diffusion characteristics of polycrystalline graphene barriers Yoon, Tae-Shik; Mun, Jeong-Hun; Cho, Byung Jin; Kim, Taek-Soo, NANOSCALE, v.6, no.1, pp.151 - 156, 2014-01 | |
| Display process compatible accurate graphene patterning for OLED applications Shin, Jin-Wook; Han, Jun-Han; Cho, Hyunsu; Moon, Jaehyun; Kwon, Byoung-Hwa; Cho, Seungmin; Yoon, Taeshik; Kim, Taek-Soo; Suemitsu, Maki; Lee, Jeong-Ik; Cho, Nam Sung, 2D Materials, v.5, no.1, 2018-01 | |
| Reinforcing Ag nanoparticle thin films with very long Ag nanowires Lee, Inhwa; Lee, Jinhwan; Ko, Seung Hwan; Kim, Taek-Soo, NANOTECHNOLOGY, v.24, no.41, 2013-10 | |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate Ko, Yong Ho; Kim, Min-Su; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.7, pp.2458 - 2466, 2015-07 | |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |