Search
Results 1-3 of 3 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06 | |
| A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films Jung, Seung-Yoon; Oh, Seung Jin; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183, 2020-01 | |
| A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates Jung, Seung-Yoon; Lee, Tae-Ik; Cho, Minsun; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367, 2020-03 |
Discover
Type
- 3 Article