A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films

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Cu pattern-laminated fabric substrates using epoxy-based B-stage adhesive films were demonstrated. Fine-pitch Cu electrical patterns were fabricated on B-stage adhesive films and then laminated to fabrics. As a result, fabric substrates having minimum Cu line width of $80\mu \text{m}$ were successfully fabricated without any Cu lines displacement and fabric damages. First, the effects of the curing properties of adhesive films on fine-pitch Cu patterning were investigated by Fourier transform infrared (FTIR) spectroscopy and a 90 & x00B0; peel adhesion test. In addition, the morphology of the Cu pattern-laminated fabric substrates was observed depending on the viscosity of epoxy laminating adhesive film. Finally, the effects of film moduli on the dynamic bending fatigue properties were investigated experimentally and theoretically.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2020-01
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.1, pp.176 - 183

ISSN
2156-3950
DOI
10.1109/TCPMT.2019.2936514
URI
http://hdl.handle.net/10203/272104
Appears in Collection
ME-Journal Papers(저널논문)MS-Journal Papers(저널논문)
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