A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates

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In this article, chip-on-fabric (COFa) assemblies using anisotropic conductive films (ACFs) and metal-laminated fabric substrates were investigated. To fabricate the metal-laminated fabric substrates, electroless nickel-immersion gold (ENIG) metal-finished Cu circuits were fabricated on the B-stage nonconductive films (NCFs), followed by laminating onto the fabrics. Then, the 50- $\mu \text{m}$ -thick Si chip was bonded onto the fabric substrates using ACFs with a thermocompression (T/C) bonding method. First, the ACFs' joint properties, such as electrical resistances and adhesion strengths, were evaluated and compared with conventional chip-on-flex (COF) assembly. To enhance static bending flexibility without chip fracture, chip-in-fabric (CIFa) assemblies were developed after optimizing the thickness of a cover layer on the Si chip. Finally, mechanical and moisture-related reliability of the CIFa packages was evaluated through dynamic bending, 85 degrees C/85% relative humidity (RH), and washing reliability.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2020-03
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.360 - 367

ISSN
2156-3950
DOI
10.1109/TCPMT.2020.2968359
URI
http://hdl.handle.net/10203/273877
Appears in Collection
ME-Journal Papers(저널논문)MS-Journal Papers(저널논문)
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