MS-Journal Papers(저널논문)
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1
Advanced parametrization for the production of high-energy solid-state lithium pouch cells containing polymer electrolytes
Lee, Wonmi; Lee, Juho; Yu, Taegyun; Kim, Hyeong-Jong; Kim, Min Kyung; Jang, Sungbin; Kim, Juhee; Han, Yu-Jin; Choi, Sunghun; Choi, Sinho; Kim, Tae-Hee; Park, Sang-Hoon; Jin, Wooyoung; Song, Gyujin; Seo, Dong-Hwa; Jung, Sung-Kyun; Kim, Jinsoo, Nature Communications, v.15, no.1, 2024-12
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2
Abnormal martensitic transformation and morphology induced by chemical heterogeneity in additively manufactured maraging steel
노현빈; Han, Jeongho; Ryou, KenHee; Choi, Pyuck-Pa, SCRIPTA MATERIALIA, v.253, 2024-12
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Ferrite-enabled improvement of hydrogen embrittlement through strain partitioning in quenching and partitioning steels
Kim, Ki Jeong; Song, Sang Yoon; Lee, Gunjick; Kim, Hye-Jin; Um, Ho Yong; Hyun, Joo-Sik; Jung, Seung-Pill; Ryou, KenHee; Choi, Pyuck-Pa; Zargaran, Alireza; Lee, Myoung-Gyu; Sohn, Seok Su, MATERIALS SCIENCE AND ENGINEERING, v.913, 2024-10
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Ultra-high areal capacity, ultra-long life, dendrite-free sodium metal anode enabled by antimony-based Na-ion conducting artificial SEI layers
Moorthy, Megala; Thangavel, Ranjith; Krishnan Ganesan, Bala; Saha, Aditi; Hong, Seungbum; Lee, Yun-Sung, Chemical Engineering Journal, v.498, pp.155234, 2024-10
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Unveiling the Nanoscale Dielectric Gap and Its Influence on Ferroelectric Polarization Switching in Scanning Probe Microscopy
EOM, SEONGMUN; Kavle, Pravin; Kang, Deokyoung; Kim, Yeon-gyu; Martin, Lane W.; HONG, DANIEL SEUNGBUM, Advanced Functional Materials, 2024-09
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Mott neurons with dual thermal dynamics for spatiotemporal computing
Kim, Gwangmin; In, Jae Hyun; Lee, Younghyun; Rhee, Hakseung; Park, Woojoon; Song, Hanchan; Park, Juseong; Jeon, Jae Bum; Brown, Timothy D.; Talin, A. Alec; Kumar, Suhas; Kim, Kyung Min, NATURE MATERIALS, v.23, no.9, 2024-09
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7
Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09
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8
Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
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Advancing Charge Density in Temperature‐Dependent Amphiphile Metal–Organic Polyhedra‐Based Triboelectric Nanogenerators
Ippili, Swathi; Kumar, Gobbilla Sai; Sharma, Arti; Ko, Yoonah; Hong, Seungbum; Goddati, Mahendra; Saini, Haneesh; Lee, Jaebeom; Yang, Tae‐Youl; Siddhanta, Soumik; Jella, Venkatraju; Yoon, Soon‐Gil; Jayaramulu, Kolleboyina, Advanced Energy Materials, 2024-08
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10
Lateral Piezoelectricity of Alzheimer's Aβ Aggregates
Jang, Jinhyeong; Joo, Soyun; Yeom, Jiwon; Jo, Yonghan; Zhang, Jingshu; Hong, Seungbum; Park, Chan Beum, ADVANCED SCIENCE, 2024-08
Collection's Items (Sorted by Submit Date in Descending order): 7261 to 7280 of 7319
| Atomic layer deposition of ruthenium thin films for copper glue layer Kwon, OK; Kim, JH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.2, pp.G109 - G112, 2004-01 |
| Film growth model of atomic layer deposition for multicomponent thin films Kim, JH; Kim, JY; Kang, SW, JOURNAL OF APPLIED PHYSICS, v.97, no.9, 2005-05 |
| Step coverage modeling of thin films in atomic layer deposition Kim, Ja-Yong; Ahn, Ji-Hoon; Kang, Sang-Won; Kim, Jin-Hyock, JOURNAL OF APPLIED PHYSICS, v.101, no.7, 2007-04 |
| Improvement of the morphological stability by stacking RuO2 on ru thin films with atomic layer deposition Kwon, Se-Hun; Kwon, Oh-Kyum; Kim, Jae-Hoon; Jeong, Seong-Jun; Kim, Sung-Wook; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.154, no.9, pp.H773 - H777, 2007 |
| The Mechanism of Si Incorporation and the Digital Control of Si Content during the Metallorganic Atomic Layer Deposition of Ti-Si-N Thin Films Min, Jae-Sik; Park, Jin-Seong; Park, Hyung-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.10, pp.3868 - 3872, 2000-06 |
| Effect of crystallinity and nonstoichiometric region on dielectric properties of SrTiO3 films formed on Ru Kim, Ja-Yong; Ahn, Ji-Hoon; Kang, Sang-Won; Kim, Jin-Hyock; Roh, Jae-Sung, APPLIED PHYSICS LETTERS, v.91, no.9, 2007-08 |
| Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Chae, Jung-Hun; Lee, Jae-Youl; Kang, Sang-Won, SPIE Vol. 3242, pp.202-211, 1997 |
| A.C. Complex Impedance Investigation of RuO2-Glass Composites Koo, Bon Keup; No, Kwangsoo; Kim, Ho Gi, IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS AND MANUFACTURING TECHNOLOGY, v.14, no.3, pp.580 - 584, 1991-09 |
| Thermal expansivity below 300K and low temperature heat capacity of YBa2Cu3O7 Swenson, CA; McCallum, RW; No, Kwangsoo, PHYSICAL REVIEW B, v.40, no.13, pp.8861 - 8871, 1989-11 |
| Fabrication of textured YBa2Cu3Ox superconductor using directional growth No, Kwangsoo; Chung, Dae Shik; Kim, Jae Myung, JOURNAL OF MATERIALS RESEARCH, v.5, no.11, pp.2610 - 2612, 1990-07 |
| GRAIN-SIZE CONTROL IN POWDER PROCESSED Y1BA2CU3OX No, Kwangsoo; VERHOEVEN, JD; MCCALLUM, RW; GIBSON, ED, IEEE TRANSACTIONS ON MAGNETICS, v.25, no.2, pp.2184 - 2187, 1989-03 |
| THERMAL-WAVE IMAGING OF VOIDS IN STRUCTURAL CERAMICS No, Kwangsoo; Mcclelland, JF, JOURNAL OF APPLIED PHYSICS, v.64, no.5, pp.2801 - 2803, 1988-09 |
| Thermal-Wave imaging of Epocy Aluminum Interfaces No, Kwangsoo; Mcclelland, JF, JOURNAL OF APPLIED PHYSICS, v.64, no.4, pp.1730 - 1735, 1988-08 |
| Antioxidation properties of Ti0.83Al0.17N prepared using plasma-enhanced atomic layer deposition Lee, YJ; Kang, Sang-Won, APPLIED PHYSICS LETTERS, v.86, no.7, 2005-02 |
| Increment of dielectric properties of SrTiO3 thin films by SrO interlayer on Ru bottom electrodes Ahn, Ji-Hoon; Kim, Ja-Yong; Kang, Sang-Won, APPLIED PHYSICS LETTERS, v.91, no.6, 2007-08 |
| Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10 |
| Effect of electromigration on mechanical shear behavior of flip chip solder joints Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03 |
| Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates Cho, SD; Jang, KW; Hyun, JG; Lee, S; Paik, Kyung-Wook; Kim, HS; Kim, Joungho, IEEE TRANCSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.28, no.4, pp.297 - 303, 2005-10 |
| Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications Jang, KW; Kwon, WS; Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.608 - 615, 2004-09 |
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