DSpace at KOASAS: Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Journal Papers(저널논문)

Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

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Jeon, Chansu / Kang, Sukkyung / Kim, Myeong Eun / Park, Juseong / Kim, Daehee / Kim, Sanha researcher / Kim, Kyung Min researcher

Publisher: American Chemical Society (ACS)

Issue Date: 2024-09

Language: English

Citation: ACS Applied Materials &amp; Interfaces, v.16, no.36, pp.48481 - 48487

ISSN: 1944-8244

DOI: 10.1021/acsami.4c08390

URI: http://hdl.handle.net/10203/323093

Appears in Collection: ME-Journal Papers(저널논문)MS-Journal Papers(저널논문)

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