MS-Journal Papers(저널논문)
- Browse
- Issue Date Author Title Subject Type
Recent Items
-
1
Zn anode with hydrophobic and ferroelectric P(VDF-TrFE) layers for dendrite-free aqueous Zn-ion batteries
Park, Hyeonghun; Seol, Woojun; Park, Geumyong; Anoop, Gopinathan; Kim, Juhun; Tamulevicius, Tomas; Tamulevicius, Sigitas; Joo, Soyun; HONG, DANIEL SEUNGBUM; Jo, Ji Young; Kim, Hyeong-Jin, APPLIED SURFACE SCIENCE, v.660, 2024-07
-
2
Fe-based high-entropy alloy with excellent mechanical properties enabled by nanosized precipitates and heterogeneous grain distribution
Jung, Heechan; Lee, Sangwon; Kang, Taehyeok; Zargaran, Alireza; Choi, Pyuck-Pa; Sohn, Seok Su, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.181, pp.71 - 81, 2024-05
-
3
Cancer-targeting Gold-decorated Melanin Nanoparticles for In vivo Near-infrared Photothermal Therapy
Pornnoppadol, Gahsidit; Cho, Soojeong; Yu, Jeong Heon; Kim, Shin-Hyun; Nam, Yoon Sung, MOLECULAR SYSTEMS DESIGN & ENGINEERING, v.9, no.5, pp.507 - 517, 2024-05
-
4
Compositionally Sequenced Interfacial Layers for High-Energy Li-Metal Batteries
Lee, Jeong-A; Cho, Yoonhan; Kim, Saehun; Kweon, Seong Hyeon; Kang, Haneul; Byun, Jeong Hwan; Kwon, Eunji; Seo, Samuel; Ryu, Kyoung Han; Kim, Wonkeun; Kwak, Sang Kyu; Choi, Nam-Soon; HONG, DANIEL SEUNGBUM, ADVANCED SCIENCE, v.11, no.17, 2024-05
-
5
Composition and state prediction of lithium-ion cathode via convolutional neural network trained on scanning electron microscopy images
Oh, Jimin; Yeom, Jiwon; Madika, Benediktus; Kim, Kwang Man; Liow, Chi Hao; Agar, Joshua C; Hong, Seungbum, NPJ COMPUTATIONAL MATERIALS, v.10, no.1, 2024-05
-
6
Regulating ionic transport and interface chemistry via high-dielectric BaTiO3 porous scaffolds for aqueous Zn-ion batteries
Naresh N.; Hyeon D.Y.; Lee D.P.; Lee S.J.; Jeong S.H.; Lee S.Y.; Kim D.K.; Park K.-I.; Kim J.-H., Journal of Power Sources, v.603, 2024-05
-
7
Balancing Ionic and Electronic Conduction at the LiFePO4 Cathode–Electrolyte Interface and Regulating Solid Electrolyte Interphase in Lithium-Ion Batteries
Moon, Hyeongyu; Kim, Donguk; Hong, Seungbum; Park, Gun; Shin, Kwongyo; CHO, YOONHAN; Gong, Chaewon; Lee, Yoon-Sung; Choi, Nam-Soon, Advanced Functional Materials, 2024-05
-
8
Maximizing Photoelectrochemical Performance in Metal-Oxide Hybrid Composites via Amorphous Exsolution-A New Exsolution Mechanism for Heterogeneous Catalysis
Kim, Myeong-Jin; Hassan, Mostafa Afifi; Lee, Changhoon; Jung, Wan-Gil; Bae, Hyojung; Jeon, Sunghyun; Jung, Woochul; Ha, Jun-Seok; Shim, Ji Hoon; Park, Jae-Hoon; Ryu, Sang-Wan; Kim, Bong-Joong, SMALL, v.20, no.18, 2024-05
-
9
On the Role of Bimetal-doped BaCo3-δ Perovskites as Highly Active Oxygen Electrodes of Protonic Ceramic Electrochemical Cells
KIM, DONGYEON; Jeong, In Cheol; Ahn, Se Jong; Song, Sun Ju; Lee, Chan Woo; Jung, WooChul; Lee, Kang Taek, ADVANCED ENERGY MATERIALS, v.14, no.14, 2024-04
-
10
Data-driven design of NASICON-type electrodes using graph-based neural networks
HONG, DANIEL SEUNGBUM; Shim, Yoon Su; 허준표; Jeong, Incheol; Jenn, Hyoungjeen; Myung, Seung-Taek; Lee, Kang Taek; Yuk, Jong Min; Lee, Chan-Woo, Batteries & Supercaps, 2024-04
Collection's Items (Sorted by Submit Date in Descending order): 7181 to 7200 of 7213
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
| The contact resistance and reliability of anisotropically conductive film (ACF) Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.2, pp.166 - 173, 1999-05 |
| Development of three-dimensional memory die stack packages using polymer insulated sidewall technique Ko, HS; Kim, JS; Yoon, HG; Jang, SY; Cho, SD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.252 - 256, 2000-05 |
| A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07 |
| A thermomechanical analysis of MCM-D substrate of polymer and metal multilayer Lim, JH; Kim, JS; Paik, Kyung-Wook; Earmme, Youn-Young, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2, v.183-1, pp.1123 - 1128, 2000 |
| Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| The multilayer modified Stoney's formula for the laminated polymer composites on a silicon substrate Paik, Kyung-Wook; Kim, JS; Oh, SH, JOURNAL OF APPLIED PHYSICS, v.86, no.10, pp.5474 - 5479, 1999-11 |
| Tensile and fracture properties of NiAl/Ni micro-laminated composites prepared by reaction synthesis Kim, HY; Chung, DS; Enoki, M; Hong, Soon-Hyung, JOURNAL OF MATERIALS RESEARCH, v.21, pp.1141 - 1149, 2006-05 |
| Mechanism for controlling the shape of Cu nanocrystals prepared by the polyol process Cha, SI; Mo, CB; Kim, KT; Jeong, YJ; Hong, Soon-Hyung, JOURNAL OF MATERIALS RESEARCH, v.21, pp.2371 - 2378, 2006-09 |
| Investigation of flip chip under bump metallization systems of Cu pads Nah, JW; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37, 2002-03 |
| Thermomechanical stress analysis of laminated thick-film multilayer substrates Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06 |
| Photochromism in spiropyran impregnated fluorinated mesoporous organosilicate films Bae, JY; Jung, JI; Bae, Byeong-Soo, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2503 - 2509, 2004-08 |
| Optical characteristics of photo-curable methacryl-oligosiloxane nano hybrid thick films Eo, YJ; Kim, JH; Ko, JH; Bae, Byeong-Soo, JOURNAL OF MATERIALS RESEARCH, v.20, no.2, pp.401 - 408, 2005-02 |
| Deposition of fluorinated amorphous carbon thin films as a low-dielectric-constant material Han, Sang Soo; Kim, Hun Rae; Bae, Byeong-Soo, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.146, no.9, pp.3383 - 3388, 1999-09 |
| Preparation of a-SiNx thin film with low hydrogen content by inductively coupled plasma enhanced chemical vapor deposition Han, SS; Jun, BH; No, Kwangsoo; Bae, Byeong-Soo, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.145, no.2, pp.652 - 658, 1998-02 |
| Photoinduced condensation of sol-gel hybrid glass films doped with benzildimethylketal Park, OH; Jung, JI; Bae, Byeong-Soo, JOURNAL OF MATERIALS RESEARCH, v.16, no.7, pp.2143 - 2148, 2001-07 |
Discover
Open Access
- 264 OA Article
Date issued
- 983 2020 - 2024
- 2,625 2010 - 2019
- 2,168 2000 - 2009
- 1,240 1990 - 1999
- 179 1980 - 1989