MS-Journal Papers(저널논문)
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1
Advanced parametrization for the production of high-energy solid-state lithium pouch cells containing polymer electrolytes
Lee, Wonmi; Lee, Juho; Yu, Taegyun; Kim, Hyeong-Jong; Kim, Min Kyung; Jang, Sungbin; Kim, Juhee; Han, Yu-Jin; Choi, Sunghun; Choi, Sinho; Kim, Tae-Hee; Park, Sang-Hoon; Jin, Wooyoung; Song, Gyujin; Seo, Dong-Hwa; Jung, Sung-Kyun; Kim, Jinsoo, Nature Communications, v.15, no.1, 2024-12
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2
Abnormal martensitic transformation and morphology induced by chemical heterogeneity in additively manufactured maraging steel
노현빈; Han, Jeongho; Ryou, KenHee; Choi, Pyuck-Pa, SCRIPTA MATERIALIA, v.253, 2024-12
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Ferrite-enabled improvement of hydrogen embrittlement through strain partitioning in quenching and partitioning steels
Kim, Ki Jeong; Song, Sang Yoon; Lee, Gunjick; Kim, Hye-Jin; Um, Ho Yong; Hyun, Joo-Sik; Jung, Seung-Pill; Ryou, KenHee; Choi, Pyuck-Pa; Zargaran, Alireza; Lee, Myoung-Gyu; Sohn, Seok Su, MATERIALS SCIENCE AND ENGINEERING, v.913, 2024-10
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Ultra-high areal capacity, ultra-long life, dendrite-free sodium metal anode enabled by antimony-based Na-ion conducting artificial SEI layers
Moorthy, Megala; Thangavel, Ranjith; Krishnan Ganesan, Bala; Saha, Aditi; Hong, Seungbum; Lee, Yun-Sung, Chemical Engineering Journal, v.498, pp.155234, 2024-10
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Unveiling the Nanoscale Dielectric Gap and Its Influence on Ferroelectric Polarization Switching in Scanning Probe Microscopy
EOM, SEONGMUN; Kavle, Pravin; Kang, Deokyoung; Kim, Yeon-gyu; Martin, Lane W.; HONG, DANIEL SEUNGBUM, Advanced Functional Materials, 2024-09
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Mott neurons with dual thermal dynamics for spatiotemporal computing
Kim, Gwangmin; In, Jae Hyun; Lee, Younghyun; Rhee, Hakseung; Park, Woojoon; Song, Hanchan; Park, Juseong; Jeon, Jae Bum; Brown, Timothy D.; Talin, A. Alec; Kumar, Suhas; Kim, Kyung Min, NATURE MATERIALS, v.23, no.9, 2024-09
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7
Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition
Jeon, Chansu; Kang, Sukkyung; Kim, Myeong Eun; Park, Juseong; Kim, Daehee; Kim, Sanha; Kim, Kyung Min, ACS Applied Materials & Interfaces, v.16, no.36, pp.48481 - 48487, 2024-09
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8
Artificial synaptic devices based on biomimetic electrochemistry: A review
Baek, Ji Hyun; Im, In Hyuk; Hur, Eun-Mi; Park, Jungwon; Lim, Jongwoo; Kim, Sangbum; Kang, Kibum; Kim, SY; Song, JY; Jang, Ho Won, MATERIALS RESEARCH BULLETIN, v.176, 2024-08
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Advancing Charge Density in Temperature‐Dependent Amphiphile Metal–Organic Polyhedra‐Based Triboelectric Nanogenerators
Ippili, Swathi; Kumar, Gobbilla Sai; Sharma, Arti; Ko, Yoonah; Hong, Seungbum; Goddati, Mahendra; Saini, Haneesh; Lee, Jaebeom; Yang, Tae‐Youl; Siddhanta, Soumik; Jella, Venkatraju; Yoon, Soon‐Gil; Jayaramulu, Kolleboyina, Advanced Energy Materials, 2024-08
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10
Lateral Piezoelectricity of Alzheimer's Aβ Aggregates
Jang, Jinhyeong; Joo, Soyun; Yeom, Jiwon; Jo, Yonghan; Zhang, Jingshu; Hong, Seungbum; Park, Chan Beum, ADVANCED SCIENCE, 2024-08
Collection's Items (Sorted by Submit Date in Descending order): 7021 to 7040 of 7317
| Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study Kwon, WS; Ham, SJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, no.2-4, pp.589 - 599, 2006 |
| Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection Yim, MJ; Kwon, W; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.126, pp.59 - 65, 2006-01 |
| Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11 |
| Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films Cho, SD; Lee, SY; Hyun, JG; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.16, pp.77 - 84, 2005-02 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Hyun, JG; Cho, SD; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1264 - 1269, 2005-09 |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Kim, HJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1165 - 1171, 2005-08 |
| Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
| Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09 |
| Study on epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate applications Cho, SD; Lee, JY; Hyun, JG; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.110, pp.233 - 239, 2004-07 |
| Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08 |
| Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array Jang, Seok Pil; Kim, sung Jin; Paik, Kyung wook, Sensors and Actuators a v.105 n.2, Pages 211-224, 2003-07-15 |
| A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
| Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
| A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
| Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04 |
| Study on the amorphous Ta2O5 thin film capacitors deposited by dc magnetron reactive sputtering for multichip module applications Cho, SD; Paik, Kyung-Wook, MATERIALS SCIENCE & ENGINEERING B: SOLID-STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.67, no.3, pp.108 - 112, 1999-12 |
| Influence of rhenium on the microstructures and mechanical properties of a mechanically alloyed oxide dispersion-strengthened nickel-base superalloy Ko, HS; Paik, Kyung-Wook; Park, LJ; Kim, YG; Tundermann, JH, JOURNAL OF MATERIALS SCIENCE, v.33, no.13, pp.3361 - 3370, 1998-07 |
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