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Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study Kwon, WS; Ham, SJ; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, no.2-4, pp.589 - 599, 2006 |
Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection Yim, MJ; Kwon, W; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.126, pp.59 - 65, 2006-01 |
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11 |
Comparison of theoretical predictions and experimental values of the dielectric constant of epoxy/BaTiO3 composite embedded capacitor films Cho, SD; Lee, SY; Hyun, JG; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.16, pp.77 - 84, 2005-02 |
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
A study on the temperature dependence of epoxy/BaTiO3 composite embedded capacitor films Hyun, JG; Cho, SD; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1264 - 1269, 2005-09 |
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Kim, HJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1165 - 1171, 2005-08 |
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages Lee, BW; Jang, W; Kim, DW; Jeong, J; Nah, JW; Paik, Kyung-Wook; Kwon, D, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.380, pp.231 - 236, 2004-08 |
Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09 |
Study on epoxy/BaTiO3 composite embedded capacitor films (ECFs) for organic substrate applications Cho, SD; Lee, JY; Hyun, JG; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.110, pp.233 - 239, 2004-07 |
Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Yim, MJ; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.26, pp.304 - 313, 2006-08 |
Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array Jang, Seok Pil; Kim, sung Jin; Paik, Kyung wook, Sensors and Actuators a v.105 n.2, Pages 211-224, 2003-07-15 |
A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.32, pp.548 - 557, 2003-06 |
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
(UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04 |
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