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Results 61-70 of 119 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly Jang, KW; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730, IEEE, 2007-05-29 | |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 | |
| Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder Bumps Jang, SY; Jurgen Wolf; Oswin Ehrmann; Heinz Gloor; Herbert Reichl; Paik, Kyung-Wook, MicroSystem Technologies, MicroSystem Technologies, 2001-03-27 | |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03 | |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, Jae-Woong; Kim, Jong Hoon; Lee, Hyuck-Mo; Paik, Kyung-Wook, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 | |
| Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints Kwon, YM; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Effects of Anisotropic Conductive Film (ACF) viscosity on ACF fillet and moisture-related reliability for Flip-chip-on-board (FCOB) packages Jang, KW; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Characterization of Epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.2046 - 2050, 123, 2009-05-26 | |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 | |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 |