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Results 1-10 of 13 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Conduction mechanism of Anisotropic Conductive Adhesives (ACAs): Conductor ball deformation and build-up of contraction stresses Kwon, WS; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.214 - 220, 2005-03-16 | |
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 | |
| Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11 | |
| Anisotropic Conductive Films (ACFs) for ultra-fine Pitch Chip-On-Glass (COG) applications Yim, MJ; Hwang, J; Paik, Kyung-Wook, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.181 - 186, 2005-03-16 | |
| Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07 | |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; Cho, SJ; Paik, Kyung-Wook, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 | |
| Epoxy/BaTiO3 (SrTiO3) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Paik, Kyung-Wook; Cho, SD; Hyun, JG; Lee, S; Kim, H; Kim, J, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.227 - 232, 2005-03-16 | |
| 플립칩 접속을 위한 비전도성 필름 (NCFs)의 관능기가 물질 특성 및 신뢰성에 미치는 영향 Paik, Kyung-Wook, 한국마이크로전자 및 패키징 학회, pp.37 - 44, 한국마이크로전자 및 패키징 학회, 2005-11-01 | |
| Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16 | |
| Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31 |
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