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Results 1-9 of 9 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Assembly yield enhancement of electroless Ni-P UBM/Pb-free solder joints Kwon, YM; Jeon, YD; Paik, Kyung-Wook; Kim, JD; Lee, JW, 7th Electronics Packaging Technology Conference, EPTC 2005, v.1, pp.287 - 291, 2005-12-07 | |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; Byun, KY; Joh, CH; Do, EH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 | |
| Bumpless ball grid array (BBGA) package using a solder resist cavity Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26 | |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 | |
| Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints Kwon, YM; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 | |
| Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 | |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 | |
| Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish Park, YS; Kwon, YM; Son, HY; Moon, JT; Jeong, BW; Kang, KI; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0, 123, 2007-11-19 |
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