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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Pd-Free Bumping Technology and UBM (Under Bump Metallurgy) Jang, SY; Paik, Kyung-Wook; Wolf, J; Reichl, H, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.121 - 128, 2001-11-01 | |
| Bubbles formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on ACFs joints reliability Kim, HJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, 7th Electronics Packaging Technology Conference, 2005, v.2, pp.734 - 739, 2005-12-07 | |
| Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder Bumps Jang, SY; Jurgen Wolf; Oswin Ehrmann; Heinz Gloor; Herbert Reichl; Paik, Kyung-Wook, MicroSystem Technologies, MicroSystem Technologies, 2001-03-27 | |
| UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration Jang, SY; Wolf, J; Kwon, WS; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.1213 - 1220, IEEE, 2002-05-28 | |
| Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30 | |
| Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29 |
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