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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Pd-Free Bumping Technology and UBM (Under Bump Metallurgy)

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Jang, SY / Paik, Kyung-Wookresearcher / Wolf, J / Reichl, H
Issue Date
2001-11-01
Language
ENG
Citation

Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.121 - 128

URI
http://hdl.handle.net/10203/136517
Appears in Collection
MS-Conference Papers(학술회의논문)
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