Pd-Free Bumping Technology and UBM (Under Bump Metallurgy)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, SY | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Wolf, J | - |
| dc.contributor.author | Reichl, H | - |
| dc.date.accessioned | 2013-03-16T22:19:16Z | - |
| dc.date.available | 2013-03-16T22:19:16Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2001-11-01 | - |
| dc.identifier.citation | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, v., no., pp.121 - 128 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/136517 | - |
| dc.language | ENG | - |
| dc.title | Pd-Free Bumping Technology and UBM (Under Bump Metallurgy) | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 121 | - |
| dc.citation.endingpage | 128 | - |
| dc.citation.publicationname | Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Jang, SY | - |
| dc.contributor.nonIdAuthor | Wolf, J | - |
| dc.contributor.nonIdAuthor | Reichl, H | - |
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